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Last edited anonymously
April 29, 2008 | History
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Shyam P. Murarka

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7 works Add another?

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  • Cover of: Copper-fundamental mechanisms for microelectronic applications

    First published in 2000 — 3 editions
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  • Cover of: Advanced metallizations in microelectronics: symposium held April 16-20, 1990, San Francisco, California, U.S.A.

    First published in 1990 — 3 editions
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  • Cover of: Advanced Metallization for Devices and Circuits - Science, Technology, and Manufacturability: Symposium Held April 4-8, 1994, San Francisco (Materials Research Society Symposia Proceedings, V. 337.)

    First published in 1994 — 2 editions
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  • Cover of: Advanced metallization and processing for semiconductor devices and circuits--II: symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.

    First published in 1992 — 2 editions
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  • Cover of: Silicides for VLSI Applications

    First published in 2012 — 1 edition
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  • Cover of: Advanced Metallization and Processing for Semiconductor Devices and Circuits - III

    First published in 2014 — 1 edition
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  • Cover of: Electromigration and Stress Voiding

    First published in 2008 — 1 edition
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Subjects

Metallizing, Semiconductors, Congresses, Metallic films, Design and construction, Microelectronics, Science/Mathematics, Thin films, Vapor-plating, Compound semiconductors, Copper, Electronic Engineering (Specific Aspects), Electronics - Semiconductors, Junctions, Materials, Materials, research, Technology, Technology & Industrial Arts

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ID Numbers

  • OLID: OL2737492A

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History

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April 29, 2008 Created by an anonymous user initial import