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Last edited anonymously
April 29, 2008 | History
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William T. Chen

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4 works Add another?

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  • Cover of: Manufacturing challenges in electronic packaging

    First published in 1997 2 editions in 1 language
    Not in Library

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  • Cover of: Application of Fracture Mechanics in Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and Exposition, November ... Dallas, Texas (Amd (Series), Vol. 222.)

    First published in 1997 2 editions in 1 language
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  • Cover of: Manufacturing aspects in electronic packaging 1993: presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

    First published in 1993 1 edition in 1 language
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  • Cover of: Advances in Electronic Packaging 1992: Proceedings of the 1992 Joint Asme/Jsme Conference on Electronic Packaging (Pd)

    First published in 1992 1 edition in 1 language
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Subjects
Electronic packaging, Congresses, Manufacturing processes, Fracture, Fracture mechanics, Materials, Multichip modules (Microelectronics), Production management

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ID Numbers

  • OLID: OL2782718A

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History

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April 29, 2008 Created by an anonymous user initial import