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Last edited anonymously
April 29, 2008 | History

Luu T. Nguyen

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  • Cover of: Electronic packaging reliability: presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

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  • Cover of: Electronic Packaging Reliability: Presented at the 1993 Asme Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 (AMD)

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  • Cover of: Plastic-encapsulated microelectronics: materials, processes, quality, reliability, and applications

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  • Cover of: New characterization techniques for thin polymer films

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April 29, 2008 Created by an anonymous user initial import