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Last edited anonymously
April 29, 2008 | History
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IEEE Components Packaging & Manufacturin

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  • Cover of: Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium: March 5-7, 1996, Four Seasons Hotel, Austin, TX, USA

    First published in 1996 3 editions in 1 language
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  • Cover of: Proceedings of the 1999 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits [Ipfa '99: 5-9 July, 1999, Orchard Hotel

    First published in 1999 3 editions in 1 language
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  • Cover of: IEEE 50th Electronic Components and Technology Conference 2000

    First published in 2000 2 editions in 1 language
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  • Cover of: Twenty first IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA

    First published in 1997 2 editions in 1 language
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  • Cover of: Ieee/Semi International Semiconductor Manufacturing Science Symposium: July 19-20, 1993 San Francisco, Ca Usa/93Ch3280-5

    First published in 1993 2 editions in 1 language
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  • Cover of: ASMC 2000 Proceedings: 2000 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop : September 12-14, 2000, Boston, Massachusetts, USA

    First published in 2000 2 editions in 1 language
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  • Cover of: Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium: January 28-30, 1997, Four Seasons Hotel, Austin, TX, USA.

    First published in 1997 2 editions in 1 language
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  • Cover of: Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), 1998 IEEE

    First published in 1998 2 editions in 1 language
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  • Cover of: Sixteenth annual IEEE Semiconductor Thermal Measurement and Management Symposium: March 21-23, 2000, DoubleTree Hotel, San Jose, CA, USA

    First published in 2000 2 editions in 1 language
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  • Cover of: Electrical Performance of Electronic Packaging: October 27-29, 1997 : The Wyndham Hotel San Jose, California

    First published in 1997 2 editions in 1 language
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  • Cover of: 1994 44th Electronic Components & Technology Conference/94Ch3241-7 (Electronic Components and Technology Conference//Proceedings)

    First published in 1994 1 edition in 1 language
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  • Cover of: 1995 Japan Iemt Symposium: Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium : December 4-6, 1995 Omiya, Japan

    First published in 1996 1 edition in 1 language
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  • Cover of: 1996 IEEE 46th Electronic Components and Technology Conference (Ectc

    First published in 1997 1 edition in 1 language
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  • Cover of: 1996 Proceedings 46th Electronic Components & Technology Conference (IEEE Conference Publications. Ch Series)

    First published in 1996 1 edition in 1 language
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  • Cover of: 2000 IEEE 16th Annual Semiconductor Thermal Measurementand Management Symp Osium (Semi-Therm)

    First published in 2000 1 edition in 1 language
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  • Cover of: Electrical Contacts 1997: Proceedings of the Forty-Third IEEE Holm Conference on Electrical Contacts

    First published in 1997 1 edition in 1 language
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  • Cover of: Electronic Components and Technology Conference Proceedings

    First published in 2000 1 edition in 1 language
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  • Cover of: Eleventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium

    First published in 1995 1 edition in 1 language
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  • Cover of: Fifteenth International Conference on Thermoelectrics: Proceedings Ict '96 : March 26-29, 1996, Pasadena, Ca USA

    First published in 1996 1 edition in 1 language
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  • Cover of: IEEE 50th Electronic Components and Technology Conference 2000 (Electronic Components and Technology Conference//Proceedings)

    First published in 2001 1 edition in 1 language — 1 previewable
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Subjects
Congresses, Technology & Industrial Arts, Semiconductors, Engineering - Electrical & Electronic, Science/Mathematics, Cooling, Electricity, Semi-conductors & super-conductors, Technology, Thermal properties, Design and construction, Electronic packaging, Electronics - General, Electronics - Semiconductors, Circuits & components, Electronic apparatus and appliances, Electronic industries, Electronics engineering, Microelectronics, Technology & Engineering, Analytical chemistry, Computer Books: General, Computer Integrated Manufacturing (Cim), Condensed matter physics (liquids & solids), Defects

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ID Numbers

  • OLID: OL2858142A

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April 29, 2008 Created by an anonymous user initial import