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Last edited anonymously
April 30, 2008 | History
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G. S. Mathad

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8 works Add another?

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  • Cover of: Thin film materials, processes and reliability

    First published in 2001 — 1 edition
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  • Cover of: Copper Interconnects, New Contact Metal- Lurgies, & Low-k Dielectrics

    First published in 2002 — 1 edition
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  • Cover of: Highly Selective Dry Etching and Damage Control (Advances in Soil Science)

    First published in 1993 — 1 edition
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  • Cover of: Pattern Transfer in Integrated Circuit Fabrication

    First published in 2006 — 1 edition
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  • Cover of: Proceedings of the Tenth Symposium on Plasma Processing

    First published in 1994 — 1 edition
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  • Cover of: Interconnect and contact metallization for ULSI: proceedings of the international symposium

    First published in 2000 — 1 edition
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  • Cover of: Plasma etching processes for sub-quarter micron devices: proceedings of the International Symposium

    First published in 2000 — 1 edition
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  • Cover of: Proceedings of the symposia on reliability of semiconductor devices/interconnections and dielectric breakdown, and laser process for microelectronic applications

    First published in 1992 — 1 edition
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Subjects

Congresses, Design and construction, Semiconductors, Etching, Integrated circuits, Plasma etching, Copper, Dielectric devices, Dielectrics, Electric conductivity, Electric contacts, Electrochemical metallizing, Industrial applications, Lasers, Materials, Plasma-enhanced chemical vapor deposition, Reliability, Semiconductor wafers, Sputtering (Physics), Thin film devices, Thin films, Ultra large scale integration

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ID Numbers

  • OLID: OL3058524A

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History

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April 30, 2008 Created by an anonymous user initial import