It looks like you're offline.
Donate
English (en) Change Website Language
Open Library logo
additional options menu
Last edited by RenameBot
August 31, 2008 | History
Edit

Jennie S. Hwang

We need a photo of Jennie S. Hwang

6 works Add another?

Showing all works by author. Would you like to see only ebooks?

  • Cover of: Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly

    First published in 1989 — 4 editions
    Borrow Listen

    My Reading Lists:

    Create a new list

    Check-In

    ×Close
    Add an optional check-in date. Check-in dates are used to track yearly reading goals.
    Today
  • Cover of: Implementing Lead-Free Electronics (McGraw-Hill Professional Engineering)

    First published in 2004 — 2 editions
    Not in Library

    My Reading Lists:

    Create a new list

    Check-In

    ×Close
    Add an optional check-in date. Check-in dates are used to track yearly reading goals.
    Today
  • Cover of: Modern solder technology for competitive electronics manufacturing

    First published in 1995 — 2 editions
    Borrow Listen

    My Reading Lists:

    Create a new list

    Check-In

    ×Close
    Add an optional check-in date. Check-in dates are used to track yearly reading goals.
    Today
  • Cover of: Ball grid array & fine pitch peripheral interconnections: a handbook of the technology & applications for microelectronics/electronics manufacturing

    First published in 1995 — 1 edition
    Not in Library

    My Reading Lists:

    Create a new list

    Check-In

    ×Close
    Add an optional check-in date. Check-in dates are used to track yearly reading goals.
    Today
  • Cover of: Environment friendly electronics: lead-free technology

    First published in 2001 — 1 edition
    Not in Library

    My Reading Lists:

    Create a new list

    Check-In

    ×Close
    Add an optional check-in date. Check-in dates are used to track yearly reading goals.
    Today
  • Cover of: Lead-Free Solder Composition: United States Patent 9975207

    First published in 2020 — 1 edition
    Not in Library

    My Reading Lists:

    Create a new list

    Check-In

    ×Close
    Add an optional check-in date. Check-in dates are used to track yearly reading goals.
    Today
We need a photo of Jennie S. Hwang

Subjects

Solder and soldering, Electronic packaging, Design and construction, Electronic industries, Environmental aspects, Environmental aspects of Electronic industries, Environmental aspects of Solder and soldering, Green technology, Lead abatement, Microelectronic packaging, Multichip modules (Microelectronics), Printed circuits, Solder pastes, Surface mount technology

Lists

Add to List

My Reading Lists:

Create a new list

ID Numbers

  • OLID: OL454514A

Links outside Open Library

No links yet. Add one?

History

Download catalog record: RDF / JSON
August 31, 2008 Edited by RenameBot fix author name
April 1, 2008 Created by an anonymous user initial import