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Last edited by ImportBot
September 14, 2008 | History
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Christoph Steinbruchel

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  • Cover of: (WCS)Materials Science for Engineers Ready Notes Fall 2004

    First published in 2004 — 1 edition
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  • Cover of: Copper interconnect technology

    First published in 2001 — 1 edition
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Subjects

Copper, Electronic packaging, Junctions, Microelectronic packaging, Microelectronics, Semiconductors, Semiconductors -- Junctions

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ID Numbers

  • OLID: OL4688281A

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History

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September 14, 2008 Created by ImportBot Imported from Oregon Libraries MARC record