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Last edited by RenameBot
August 29, 2008 | History
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Pradeep Lall

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3 works Add another?

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  • Cover of: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach

    First published in 1997 5 editions in 1 language
    Not in Library

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  • Cover of: Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Conditioned-Based Data

    First published in 2019 4 editions in 1 language
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  • Cover of: Chip-Scale Packaging

    First published in 2002 1 edition in 1 language
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We need a photo of Pradeep Lall

Subjects
Appareils électroniques, Electricity, Electronic apparatus and appliances, Electronic packaging, Fiabilité, Health facilities, Integrated circuits, Machinery, Materials, Matériaux, Microelectronic packaging, Microelectronics, Microélectronique, Mise sous boîtier (Microélectronique), Propriétés thermiques, Reliability, Structural failures, TECHNOLOGY, Thermal properties

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ID Numbers

  • OLID: OL540791A

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History

Download catalog record: RDF / JSON
August 29, 2008 Edited by RenameBot fix author name
April 1, 2008 Created by an anonymous user initial import