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Subjects
Appareils électroniques, Electricity, Electronic apparatus and appliances, Electronic packaging, Fiabilité, Health facilities, Integrated circuits, Machinery, Materials, Matériaux, Microelectronic packaging, Microelectronics, Microélectronique, Mise sous boîtier (Microélectronique), Propriétés thermiques, Reliability, Structural failures, TECHNOLOGY, Thermal propertiesID Numbers
- OLID: OL540791A
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August 29, 2008 | Edited by RenameBot | fix author name |
April 1, 2008 | Created by an anonymous user | initial import |