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Last edited by RenameBot
August 29, 2008 | History
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Ephraim Suhir

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15 works Add another?

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  • Cover of: Structural Dynamics of Micro- and Opto-Electronic Systems

    First published in 2009 8 editions in 1 language — 2 previewable Cover of edition structuraldynami00suhi
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  • Cover of: Structural analysis in microelectronic and fiber optic systems: presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

    First published in 1991 7 editions in 1 language
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  • Cover of: Human-In-the-loop

    First published in 2018 6 editions in 1 language
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  • Cover of: Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices

    First published in 2020 6 editions in 1 language
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  • Cover of: Mechanical behavior of materials and structures in microelectronics: symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.

    First published in 1991 3 editions in 1 language — 1 previewable
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  • Cover of: Micro- and Opto-Electronic Materials and Structures : Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging

    First published in 2007 2 editions in 1 language
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  • Cover of: Structural analysis in microelectronics and fiber optics, 1996: presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

    First published in 1996 2 editions in 1 language
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  • Cover of: Reliability of photonics materials and structures: symposium held April 13-16, 1998, San Francisco, California, U.S.A.

    First published in 1998 2 editions in 1 language — 1 previewable
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  • Cover of: Fiber Optics Structural Mechanics

    First published in 2004 1 edition in 1 language
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  • Cover of: Advances in electronic packaging, 1997: proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/AWSME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii

    First published in 1997 1 edition in 1 language
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  • Cover of: Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging

    First published in 2007 1 edition in 1 language — 1 previewable
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  • Cover of: Advances in Electronic Packaging (AMD)

    First published in 1997 1 edition in 1 language
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  • Cover of: Soviet naval architecture: theory and application of hydrodynamics

    First published in 1986 1 edition in 1 language
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  • Cover of: Structural analysis in microelectronics and fiber optics, 1994: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

    First published in 1994 1 edition in 1 language
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  • Cover of: Applied probability for engineers and scientists

    First published in 1997 1 edition in 1 language
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We need a photo of Ephraim Suhir

Subjects
Congresses, Fiber optics, Microelectronic packaging, Microelectronics, Structural analysis (Engineering), Electronics, Materials, Mechanical properties, Optoelectronic devices, Probabilities, Reliability, Aeronautics, Analyse des défaillances (Ingénierie), Aéronautique, Electric contactors, Electronic apparatus and appliances, Electronic packaging, Electronic systems, Engineering, Engineering (General), Engineering design, Equipment Failure Analysis, Facteurs humains, Failure analysis (Engineering), Fault tolerance (Engineering)
Places
Soviet Union

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ID Numbers

  • OLID: OL544031A

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History

Download catalog record: RDF / JSON
August 29, 2008 Edited by RenameBot fix author name
April 1, 2008 Created by an anonymous user initial import