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Last edited by ImportBot
July 28, 2014 | History
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S. W. Ricky Lee

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  • Cover of: From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications

    First published in 2021 — 4 editions
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  • Cover of: Solder Joint Reliability

    First published in 2004 — 2 editions
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  • Cover of: Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology: presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

    First published in 2003 — 1 edition
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Subjects

Congresses, Electronic packaging, Integrated circuits, Microelectromechanical systems, Microelectronic packaging, Nanotechnology, Photonics, Solder and soldering, Surface mount technology, Wafer-scale integration, Welded joints

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ID Numbers

  • OLID: OL7203532A

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History

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July 28, 2014 Created by ImportBot import new book