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Subjects
Cooling, Electric engineering, Electronic apparatus and appliances, Electronic packaging, Electronics, Energy Efficiency (incl. Buildings), Engineering, Force and energy, Heat and Mass Transfer Engineering Thermodynamics, Heat sinks (Electronics), Heat, transmission, Instrumentation Electronics and Microelectronics, Materials, Metallic Materials, Microelectronic packaging, Microelectronics, Power (Mechanics), Power resources, Thermal propertiesID Numbers
- OLID: OL7554982A
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June 28, 2019 | Created by MARC Bot | import new book |