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Last edited by ImportBot
August 16, 2020 | History
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Vobulapuram Ramesh Kumar

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  • Cover of: Through Silicon Vias: Materials, Models, Design, and Performance

    First published in 2016 — 6 editions
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Subjects

Circuits intégrés tridimensionnels, Engineering, Integrated circuits, Interconnected electric utility systems, Interconnects (Integrated circuit technology), Interconnexions (Technologie des circuits intégrés), Mechanical, TECHNOLOGY & ENGINEERING, Three-dimensional integrated circuits

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ID Numbers

  • OLID: OL8158979A

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History

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August 16, 2020 Created by ImportBot import new book