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Subjects
Congresses, Integrated circuits, Materials, Semiconductors, Metallizing, Electronics, Materials, research, Very large scale integration, Design and construction, Dielectric films, Dielectrics, Electronic Engineering (Specific Aspects), Electronic packaging, Electronics, data processing, Electronics, materials, Elektronik, Halbleitertechnologie, Halbleiterwerkstoff, Integrated circuits, very large scale integration, Junctions, Materials, mechanical properties, Matériaux, Microelectronics, Plasma etching, Science/MathematicsID Numbers
- OLID: OL836799A
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August 22, 2008 | Edited by RenameBot | fix author name |
April 1, 2008 | Created by an anonymous user | initial import |