Solder paste in electronics packaging

technology and applications in surface mount, hybrid circuits and component assembly

Solder paste in electronics packaging
Jennie S. Hwang, Jennie S. Hwa ...
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Last edited by ImportBot
February 25, 2022 | History

Solder paste in electronics packaging

technology and applications in surface mount, hybrid circuits and component assembly

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Publish Date
Language
English
Pages
456

Buy this book

Previews available in: English

Book Details


Edition Notes

Published in
London

Classifications

Library of Congress
TK7867-7867.5

The Physical Object

Pagination
456p.
Number of pages
456

ID Numbers

Open Library
OL21422935M
ISBN 10
0442013531
OCLC/WorldCat
27214482

Source records

Better World Books record

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
February 25, 2022 Edited by ImportBot import existing book
April 28, 2011 Edited by OCLC Bot Added OCLC numbers.
December 15, 2009 Edited by WorkBot link works
November 2, 2008 Created by ImportBot Imported from Talis record