An edition of Reliability and yield problems of wire bonding in microelectronics
(1989)
Reliability and yield problems of wire bonding in microelectronics
the application of materials and interface science
by George G. Harman
Share
×Close
This edition doesn't have a description yet. Can you add one?
Check nearby libraries
Buy this book
Showing 1 featured edition. View all 1 editions?
| Edition | Availability |
|---|---|
1
Reliability and yield problems of wire bonding in microelectronics: the application of materials and interface science
1989, International Society for Hybrid Microelectronics, Intl Society of Hybrid
in English
0930815254 9780930815257
|
aaaa
Libraries near you:
WorldCat
|
Book Details
Edition Notes
Includes bibliographical references.
"A technical monograph of the International Society for Hybrid Microelectronics"--Cover.
Classifications
The Physical Object
ID Numbers
Community Reviews (0)
Feedback?
History
- Created April 1, 2008
- 6 revisions
Wikipedia citation
×CloseCopy and paste this code into your Wikipedia page. Need help?
| May 15, 2024 | Edited by ImportBot | import existing book |
| April 4, 2023 | Edited by ImportBot | import existing book |
| November 9, 2020 | Edited by MARC Bot | import existing book |
| April 16, 2010 | Edited by bgimpertBot | Added goodreads ID. |
| April 1, 2008 | Created by an anonymous user | Imported from Scriblio MARC record |