An edition of Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (2017)

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

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Cover of: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect by Jie Cheng
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Last edited by ImportBot
December 29, 2021 | History
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An edition of Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (2017)

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

by

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Publisher
Springer
Pages
155

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Subjects
Ruthenium, Grinding and polishing, Integrated circuits

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Edition Availability
Cover of: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Jan 30, 2019, Springer
paperback
  • Not in Library
Libraries near you: WorldCat
Cover of: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Sep 08, 2017, Springer
hardcover
Libraries near you: WorldCat

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Book Details

Edition Notes

Source title: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (Springer Theses)

Classifications

Library of Congress
TA1-2040

The Physical Object

Format
paperback
Number of pages
155

ID Numbers

Open Library
OL28341386M
ISBN 10
9811355851
ISBN 13
9789811355851

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amazon.com record
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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
December 29, 2021 Edited by ImportBot import existing book
July 17, 2020 Created by ImportBot Imported from amazon.com record