An edition of Force Sensors for Microelectronic Packaging Applications (2004)

Force Sensors for Microelectronic Packaging Applications

by , , and

Force Sensors for Microelectronic Packaging A ...
Jürg Schwizer, Michael Mayer, ...
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Last edited by ImportBot
December 25, 2021 | History
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An edition of Force Sensors for Microelectronic Packaging Applications (2004)

Force Sensors for Microelectronic Packaging Applications

by , , and

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Publish Date
Publisher
Springer London, Limited
Language
English

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Subjects

Electronic packaging, Metal bonding

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Edition Availability
Cover of: Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Dec 15, 2010, Springer
paperback
Libraries near you: WorldCat
Cover of: Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
2004, Springer London, Limited
in English
  • Not in Library
Libraries near you: WorldCat

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Book Details

Classifications

Library of Congress
TA401-492

The Physical Object

Pagination
viii, 178

ID Numbers

Open Library
OL35753542M
ISBN 13
9783540269458

Source records

Better World Books record

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December 25, 2021 Created by ImportBot Imported from Better World Books record