An edition of Wafer-Level Chip-Scale Packaging (2014)

Wafer-Level Chip-Scale Packaging

Analog and Power Semiconductor Applications

Shichun Qu, Liu, Yong

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March 1, 2022 | History

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An edition of Wafer-Level Chip-Scale Packaging (2014)

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Publish Date

2014

Publisher

Springer

Language

English

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Edition	Availability
1 Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications Aug 23, 2016, Springer paperback 1493954385 9781493954384	zzzz Not in Library Libraries near you: WorldCat
2 Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications Sep 11, 2014, Springer paperback 1493915576 9781493915576	zzzz Not in Library Libraries near you: WorldCat
3 Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications 2014, Springer in English 1493915568 9781493915569	aaaa Not in Library Libraries near you: WorldCat
4 Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications 2014, Springer in English 149391555X 9781493915552	zzzz Not in Library Libraries near you: WorldCat