Heat transfer in electronic equipment

presented at the winter annual meeting of the American Society of Mechanical Engineers, Washington, D.C., November 15-20, 1981

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Last edited by MARC Bot
July 11, 2022 | History

Heat transfer in electronic equipment

presented at the winter annual meeting of the American Society of Mechanical Engineers, Washington, D.C., November 15-20, 1981

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Publisher
ASME
Language
English
Pages
64

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Book Details


Table of Contents

Thermal considerations in the packaging of electrical and electronic components / A. Bar-Cohen and A. Kraus
Thermally optimum spacing of vertical, natural convection cooled, parallel plates / A. Bar-Cohen and W.M. Rohsenow
Experimental investigations on the temperature rise of printed circuit boards in open cabinets with natural ventilation / H. Birnbreier
Evaluation of surface heat transfer coefficients for electronic module packages / M.L. Buller and R.F. Kilburn
Cooling techniques and thermal analysis of circuit board mounted electronic equipment / C.J. Feldmanis
Microelectronic device thermal resistance / R.J. Hannemann
Predicting performance of forced air cooled heat sinks / F. Wenthen
Boiling heat transfer of silicon integrated-circuit chips mounted on a substrate / U.P. Hwang and K.P. Moran
Heat transfer performance of a heat pipe radiator for a 1,000 ampere thyristor with air cooling / M.D. Xin ... [et al.]

Edition Notes

Includes bibliographical references.
"HTD-vol. 20."

Published in
New York, N.Y. (345 E. 47th St., New York 10017)

Classifications

Dewey Decimal Class
621.3815
Library of Congress
TK7870.25 .H4

The Physical Object

Pagination
v, 64 p. :
Number of pages
64

ID Numbers

Open Library
OL3790409M
LCCN
81069015
OCLC/WorldCat
8138735

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History

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July 11, 2022 Edited by MARC Bot import existing book
October 21, 2020 Edited by MARC Bot import existing book
April 1, 2008 Created by an anonymous user Imported from Scriblio MARC record