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Subjects
Transmission, Cooling, Congresses, Electronic apparatus and appliances, HeatEdition | Availability |
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Book Details
Table of Contents
Thermal considerations in the packaging of electrical and electronic components / A. Bar-Cohen and A. Kraus
Thermally optimum spacing of vertical, natural convection cooled, parallel plates / A. Bar-Cohen and W.M. Rohsenow
Experimental investigations on the temperature rise of printed circuit boards in open cabinets with natural ventilation / H. Birnbreier
Evaluation of surface heat transfer coefficients for electronic module packages / M.L. Buller and R.F. Kilburn
Cooling techniques and thermal analysis of circuit board mounted electronic equipment / C.J. Feldmanis
Microelectronic device thermal resistance / R.J. Hannemann
Predicting performance of forced air cooled heat sinks / F. Wenthen
Boiling heat transfer of silicon integrated-circuit chips mounted on a substrate / U.P. Hwang and K.P. Moran
Heat transfer performance of a heat pipe radiator for a 1,000 ampere thyristor with air cooling / M.D. Xin ... [et al.]
Edition Notes
Includes bibliographical references.
"HTD-vol. 20."
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- Created April 1, 2008
- 3 revisions
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July 11, 2022 | Edited by MARC Bot | import existing book |
October 21, 2020 | Edited by MARC Bot | import existing book |
April 1, 2008 | Created by an anonymous user | Imported from Scriblio MARC record |