| Record ID | harvard_bibliographic_metadata/ab.bib.00.20150123.full.mrc:459509702:1079 |
| Source | harvard_bibliographic_metadata |
| Download Link | /show-records/harvard_bibliographic_metadata/ab.bib.00.20150123.full.mrc:459509702:1079?format=raw |
LEADER: 01079cam a2200253 a 4500
001 000582814-7
005 20020606090541.3
008 860228m19869999ne a b 00100 eng
010 $a 86004586
020 $a0444877282
035 0 $aocm13332998
040 $aDLC$cDLC
050 00 $aTA418.58$b.T43 1986
245 00 $aThermal stresses /$cedited by Richard B. Hetnarski ; reviewed by Theodore R. Tauchert and Joseph Padovan.
246 30 $aThermal stresses
260 0 $aAmsterdam ;$aNew York :$bNorth-Holland ;$bSole distributors for the U.S.A. and Canada, Elsevier Science Pub. Co.,$c1986-
300 $av. :$bill. ;$c25 cm.
440 0 $aMechanics and mathematical methods.$nSecond series,$pThermal stresses ;$vv. 1
504 $aIncludes bibliographies and indexes.
650 0 $aThermal stresses.
700 1 $aHetnarski, Richard B.
776 08 $iOnline version:$tThermal stresses I[-IV].$dAmsterdam ; New York : North-Holland ; New York : Sole distributors for the U.S.A. and Canada, Elsevier Science Pub. Co., 1986-1996$w(OCoLC)568151165
988 $a20020608
906 $0DLC