| Record ID | ia:multichipmoduled0000lica |
| Source | Internet Archive |
| Download MARC XML | https://archive.org/download/multichipmoduled0000lica/multichipmoduled0000lica_marc.xml |
| Download MARC binary | https://www.archive.org/download/multichipmoduled0000lica/multichipmoduled0000lica_meta.mrc |
LEADER: 00842cam a2200241 a 4500
001 94027455
003 DLC
005 19960717104228.8
008 940628s1995 nyua b 001 0 eng
010 $a 94027455
020 $a0070377154 :$c$55.00
040 $aDLC$cDLC$dDLC
050 00 $aTK7870.15$b.L53 1995
082 00 $a621.381/046$220
100 1 $aLicari, James J.,$d1930-
245 10 $aMultichip module design, fabrication, and testing /$cJames J. Licari.
260 $aNew York :$bMcGraw-Hill,$cc1995.
300 $axv, 381 p. :$bill. ;$c24 cm.
440 0 $aElectronic packaging and interconnection series
504 $aIncludes bibliographical references and index.
650 0 $aElectronic packaging.
650 0 $aMultichip modules (Microelectronics)$xDesign and construction.
650 0 $aMultichip modules (Microelectronics)$xTesting.