MARC record from Internet Archive

LEADER: 04735cam a22002894a 4500
001 2010040873
003 DLC
005 20120901081935.0
008 101013s2011 nyua b 001 0 eng
010 $a 2010040873
020 $a9780071753791 (hardback)
040 $aDLC$cDLC$dDLC
042 $apcc
050 00 $aTK7874.53$b.L38 2011
082 00 $a621.381/046$222
084 $aTEC008080$2bisacsh
100 1 $aLau, John H.
245 10 $aReliability of RoHS-Compliant 2D and 3D IC interconnects /$cJohn Lau.
260 $aNew York, NY :$bMcGraw-Hill Professional,$cc2011.
300 $axxix, 606 p. :$bill. (some col.) ;$c24 cm.
504 $aIncludes bibliographical references and index.
520 $a"Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This authoritative guide aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products. Reliability of RoHS-Compliant 2D and 3D IC Interconnects Covers chip-level interconnect reliability, first- and second-level interconnect reliability, and 3D IC integration interconnect reliability Addresses challenging problems created by increasing interest in lead-free interconnect reliability of 3D packaging and 3D IC integration Provides information fundamental to research and development of design (mechanical, optical, electrical, and thermal); materials; process; manufacturing; testing; and reliability for lead-free interconnects in RoHS-compliant electronics products Removes road blocks to, avoids unnecessary false starts in, and accelerates design, materials, and process development in packaging technology In-depth details: Introduction to RoHS Compliant Semiconductor and Packaging Technologies; Reliability Engineering of Lead-Free Interconnects; Notes on Failure Criterion; Reliability of 1657-Pin CCGA Lead-Free Solder Joints; Reliability of PBGA Lead-Free Solder Joints; Reliability of LED Lead-Free Interconnects; Reliability of VCSEL Lead-Free Interconnects; Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints; Reliability of Lead-Free (SACX) Solder Joints; Chip-to-Wafer (C2W) Lead-Free Interconnect Reliability; Wafer-to-Wafer (W2W) Lead-Free Interconnect Reliability; Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect Reliability; Electromigration of Lead-Free Microbumps for 3D IC Integrations; Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test Results; Effects of High Strain Rate (Impact) on SAC Solder Bumps; Effects of Voids on Solder Joints Reliability"--$cProvided by publisher.
520 $a"Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive coverage of RoHS-compliant electronics packaging solder interconnects. RoHS--the restriction of the use of certain hazardous substances in electrical and electronic equipment--is law in the EU, China, Japan, Korea, Canada, Australia, California, etc. RoHS bans lead and five other materials; thus, in order to ship electrical products to these regions and countries, products must be lead-free. The material in this book aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products"--$cProvided by publisher.
505 8 $aMachine generated contents note: Brief TOCCh 1. Introduction to RoHS Compliant Semiconductor and Packaging TechnologiesCh 2. Reliability Engineering of Lead-Free InterconnectsCh 3. Notes on Failure CriterionCh 4. Reliability of 1657-Pin CCGA Lead-Free Solder JointsCh 5. Reliability of PBGA (w/o Underfils) Lead-Free Solder JointsCh 6. Reliability of LED Lead-Free InterconnectsCh 7. Reliability of VCSEL Lead-Free InterconnectsCh 8. Reliability of Low-Temperature Lead-Free (SnBiAg) Solder JointsCh 9. Reliability of Lead-Free (SACX) Solder JointsCh 10. Chip-to-Wafer (C2W) Lead-Free Interconnect ReliabilityCh 11. Wafer-to-Wafer (W2W) Lead-Free Interconnect ReliabilityCh 12. Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect ReliabilityCh 13. Electromigration of Lead-Free Microbumps for 3D IC IntegrationsCh 14. Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test ResultsCh 15. Effects of High Strain Rate (Impact) on SAC Solder BumpsCh 16. Effects of Voids on Solder Joints Reliability.
650 0 $aInterconnects (Integrated circuit technology)$xReliability.
650 0 $aGreen technology$xReliability.
650 7 $aTECHNOLOGY & ENGINEERING / Electronics / Optoelectronics$2bisacsh.