| Record ID | ia:solderpasteinele0000hwan |
| Source | Internet Archive |
| Download MARC XML | https://archive.org/download/solderpasteinele0000hwan/solderpasteinele0000hwan_marc.xml |
| Download MARC binary | https://www.archive.org/download/solderpasteinele0000hwan/solderpasteinele0000hwan_meta.mrc |
LEADER: 00757pam a2200217 a 4500
001 88028015
003 DLC
005 19890425095139.0
008 881018s1989 nyua b 00110 eng
010 $a 88028015
020 $a0442207549
050 0 $aTK7868.P7$bH82 1989
082 0 $a621.381/74$219
100 10 $aHwang, Jennie S.
245 10 $aSolder paste in electronics packaging :$btechnology and applications in surface mount, hybrid circuits, and component assembly /$cJennie S. Hwang.
260 0 $aNew York :$bVan Nostrand Reinhold,$cc1989.
300 $axxii, 456 p. :$bill. ;$c24 cm.
504 $aIncludes bibliographies and index.
650 0 $aPrinted circuits$xDesign and construction.
650 0 $aSolder pastes.
650 0 $aSurface mount technology.