MARC Record from marc_columbia

LEADER: 07351cam a2200337 a 4500
001 4800341
005 20221103040855.0
008 040521t20042004paua b 101 0 eng d
020 $a1558997210
035 $a(OCoLC)55227731
035 $a(OCoLC)ocm55227731
035 $a(NNC)4800341
035 $a4800341
040 $aLHL$cLHL$dOCLCQ$dOrLoB-B
090 $aTK7870.15$b.M383 2003
245 00 $aMaterials, integration and packaging issues for high-frequency devices :$bsymposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. /$ceditors, P. Muralt [and others].
260 $aWarrendale, Pa. :$bMaterials Research Society,$c[2004], ©2004.
300 $axiii, 232 pages :$billustrations ;$c24 cm.
336 $atext$btxt$2rdacontent
337 $aunmediated$bn$2rdamedia
490 1 $aMaterials Research Society symposium proceedings ;$vv. 783
500 $a"This volume is a collection of half of the papers gibven at Symposium B, the first MRS symposium on 'Materials, Integration and Packaging Issues for High-Frequency devices, ' held December 1-3 at the 2003 MRS Fall Meeting in Boston, Massachusetts ..."--P. xi.
504 $aIncludes bibliographical references and indexes.
505 00 $tLow sintering temperature of CuO-fluxed Ag(Nb, Ta)O[subscript 3] dielectric ceramics /$rChiping Wang, Thomas Shrout, Gaiying Yang, Hyo-Tae Kim, Do-Kyun Kwon and Michael T. Lanagan -- $tWireless and RF module packaging using low loss ceramic and low loss organic materials /$rJames J. Logothetis, Daniel I. Amey and Timothy P. Mobley -- $tMaterial issues of low temperature Co-fired ceramic (LTCC) fine pitch chip scale package (CSP) designs /$rMegan M. Owens, Joseph W. Soucy, Thomas F. Marinis, Kevin A. Bruff and Henry G. Clausen -- $tTechniques for assessing the performance of circuit materials at microwave and millimeter-wave frequencies /$rCharles E. Free -- $tTheoretical and experimental study of barium zinc-cadmium tantalate-based microwave dielectrics /$rShaojun Liu, Mark Van Schilfgaarde, Jian Sun, Louisa Badd, David Smith, Novak S. Petrovixc, R. Taylor and N. Newman -- $tA new dielectric material system of xLa(Mg[subscript 1/2]Ti[subscript 1/2])O[subscript 3]-(1-x)CaTiO[subscript 3] at microwave frequency /$rYuan-Bin Chen, Cheng-Liang Huang and Che-Win Row -- $tOrdered structures in Ba(Cd[subscript 1/3]Ta[subscript 2/3])O[subscript 3] microwave ceramics : a transmission electron microscopy study /$rJ. Sun, S. J. Liu, N. Newman and David J. Smith -- $tMicrowave dielectric properties of (1-x)CaTiO[subscript 3]-xNd (Mg[subscript 1/2]Ti[subscript 1/2])O[subscript 3] ceramics system /$rCheng-Liang Huang, Yuan-Bin Chen and Ching-Wen Lo -- $tMicrowave dielectric properties of LaScO[subscript 3]-TiO[subscript 2] Materials /$rDo-Kyun Kwon, Michael T. Lanagan and Thomas R. Shrout -- $tDielectric properties of BaTiO[subscript 3] based ceramics prepared from nano-powders /$rXiao-Hui Wang, Ren-Zheng Chen, Zhi-Lun Gui and Long-Tu Li -- $tThe microstructures and grain boundary segregations of ceramic barium titanate processed in microwave field /$rHanxing Liu, Zhongqin Tian, Jian Zhou, Hongtao Yu, Long Zou and Shixi Ouyang -- $tRF-MEMS : materials and technology, integration and packaging /$rHarrie A. C. Tilmans -- $tPhotodefinable metal oxide dielectrics : a novel method for fabricating low cost RF capacitive MEMS switches /$rGuoan Wang, Augustin Jeyakumar, John Papapolymerou and Clifford L. Henderson -- $tHigh-Q integrated RF passives and RF-MEMS on silicon /$rJoost T. M. van Beek, Marc H. W. M. van Delden, Auke van Dijken, Patrick van Eerd, Andre B. M. Jansman, Anton L. A. M. Kemmeren, Theo G. S. M. Rijks, Peter G. Steeneken, Jaap den Toonder, Mathieu J. E. Ulenaers, Arnold den Dekker, Pieter Lok, Nick Pulsford, Freek van Straten, Lenhard van Teeffelen, Jeroen de Coster and Robert Puers -- $tIn-plane ferroelectricity in strontium titanate thin films /$rK. F. Astafiev, V. O. Sherman, M. Cantoni, A. K. Tagantsev, N. Setter, P. K. Petrov, T. Kaydanova and D. S. Ginley -- $tTunability of Bi-Rich BZN cubic pyrochlore thin films by reactive sputtering /$rDong Hyuk Back, Yook Seop Lee, Young Pyo Hong, Joong Ho Moon and Kyung Hyun Ko -- $tSolidly mounted bulk acoustic wave filters /$rH. P. Loebl, C. Metzmacher, R. F. Milsom, A. Tuinhout, P. Lok and F. van Straten -- $tInvestigation of highly c-Axis oriented AIN thin film re-growth /$rF. Martin, P. Muralt and M.-A. Dubois -- $tPulsed DC reactive magnetron sputtering of AIN thin films of high frequency LTCC substrates /$rJung W. Lee, Jerome J. Cuomo, Baxter F. Moody, Young S. Cho and Roupen L. Keusseyan -- $tCu-compatible ultra-high permittivity dielectrics for embedded passive components /$rJon F. Ihlefeld, Angus I. Kingon, William Borland and Jon-Paul Maria -- $tPassive isolators based on barium ferrite sputtered films /$rM. Le Berre, S. Capraro, J. P. Chatelon, H. Joisten, T. Rouiller, B. Bayard, D. Barbier and J. J. Rousseau -- $tHigh-density, low-loss MOS decoupling capacitors integrated in a GSM power amplifier /$rF. Roozeboom, A. Kemmeren, J. Verhoeven, E. van den Heuvel, H. Kretschman and T. Frie -- $tHigh frequency, high density interconnect using AC coupling /$rPaul Franzon, Angus Kingon, Stephen Mick, John Wilson, Lei Luo, Karthik Chandrasakhar, Jian Xu, Salvatore Bonafede, Alan Huffman, Chad Statler and Richard LaBennett -- $tDesign and performance of polymeric ultra-thin substrates for use as embedded capacitors : comparison of unfilled and filled systems with ferroelectirc particles /$rJohn Andresakis, Takuya Yamamoto, Pranabes Pramanik and Nick Buinno -- $tHigh frequency loss mechanism in polymers filled with dielectric modifiers /$rJ. Obrzut, A. Anopchenko, K. Kano and H. Wang -- $tRapid prototype fabrication of custom chip scale packages /$rMegan M. Owens, Joseph W. Soucy, Thomas F. Marinis and Henry G. Clausen -- $tSurface oxide evolution on Al-Si bond wires /$rWentao Qin, Ray Doyle, Tom Scharr, Mahesh Shah, Mike Kottke, Dennis Werho and N. David Theodore -- $tPreparation of use of chip capacitors in ultra-dense multi-chip modules /$rD. Pryputniewicz, C. Kondoleon, J. Haley and T. Marinis -- $tHigh electron mobility SiGe/Si transistor structures on sapphire substrates /$rSamuel A. Alterovitz, Carl H. Mueller, Edward T. Croke and George E. Ponchak -- $tMicrostructural evolution of Cu/Ta/GaAs multilayers with thermal annealing /$rWei-Chen Wu, Chang-You Chen, Chen-Shin Lee, Edward Yi Chang and Li Chang -- $tIntegration of III-V optoelectronic components on Si platform /$rAlex Katsnelson, Vadim Tokranov, Michael Yakimov and Serge Oktyabrsky -- $tImprovement of tantalum pentoxide metal-insulator-metal capacitors for SiGe RF BiCMOS technology /$rHongjing Sun, Ka Man Lau, Eyup Aksen and Nancy Bell.
650 0 $aElectronic packaging$xMaterials$vCongresses.$0http://id.loc.gov/authorities/subjects/sh2008119322
700 1 $aMuralt, P.
710 2 $aMaterials Research Society.$0http://id.loc.gov/authorities/names/n79060208
710 2 $aMaterials Research Society.$bFall Meeting$d(2003 :$cBoston, Mass.)
711 2 $aSymposium on Materials, Integration and Packaging Issues for High-Frequency Devices$d(2003 :$cBoston, Mass.)
830 0 $aMaterials Research Society symposia proceedings ;$vv. 783.$0http://id.loc.gov/authorities/names/n42037756
852 0 $boff,eng$hTK7870.15$i.M383 2003g