MARC Record from marc_columbia

LEADER: 02160cam a2200349Ia 4500
001 6210915
005 20221122005058.0
008 070524s2007 maua b 001 0 eng d
020 $a9781596931381
020 $a1596931388
035 $a(OCoLC)ocn135217654
035 $a(OCoLC)135217654
035 $a(NNC)6210915
035 $a6210915
040 $aRVE$cRVE$dRVE$dBAKER$dYDXCP$dOrLoB-B
090 $aTK7874.55$b.P35 2007
100 1 $aPaik, Philip Y.$0http://id.loc.gov/authorities/names/no2003105129
245 10 $aAdaptive cooling of integrated circuits using digital microfluidics /$cPhilip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula.
260 $aNorwood, Mass. :$bArtech House,$c2007.
300 $a203 pages :$billustrations ;$c24 cm.
336 $atext$btxt$2rdacontent
337 $aunmediated$bn$2rdamedia
490 1 $aArtech House integrated microsystems series
500 $aContains bibliographic references and index.
505 00 $gCh. 1.$tThermal management of integrated circuits -- $gCh. 2.$tCooling devices for integrated circuits -- $gCh. 3.$tAdaptive hot-spot cooling principles and design -- $gCh. 4.$tTechnology development -- $gCh. 5.$tThermal effects of digital microfluidic devices -- $gCh. 6.$tFlow-through - based adaptive cooling -- $gCh. 7.$tProgrammable thermal switch-based adaptive cooling -- $gCh. 8.$tConcluding remarks -- $gApp. A.$tImage analysis software using MATLAB -- $gApp. B.$tMicrofluidic chip design reference -- $gApp. C.$tRTD/heater top plate design reference -- $gApp. C.$tMaterial safety data sheet : mercury.
650 0 $aIntegrated circuits$xCooling.
650 0 $aMicrofluidics.$0http://id.loc.gov/authorities/subjects/sh2005000678
650 0 $aIntegrated circuits$xDesign and construction.$0http://id.loc.gov/authorities/subjects/sh85067118
700 1 $aChakrabarty, Krishnendu.$0http://id.loc.gov/authorities/names/n2002133223
700 1 $aPamula, Vamsee K.$q(Vamsee Krishna),$d1974-$0http://id.loc.gov/authorities/names/no2001086711
830 0 $aArtech House integrated microsystems series.$0http://id.loc.gov/authorities/names/nr2006021495
852 00 $boff,eng$hTK7874.55$i.P35 2007g