| Record ID | marc_columbia/Columbia-extract-20221130-015.mrc:33146906:3268 |
| Source | marc_columbia |
| Download Link | /show-records/marc_columbia/Columbia-extract-20221130-015.mrc:33146906:3268?format=raw |
LEADER: 03268cam a22003614a 4500
001 7094607
005 20221130205833.0
008 081202t20092009fluaf b 001 0 eng
010 $a 2008051282
020 $a9781420059113 (hardcover : alk. paper)
020 $a1420059114 (hardcover : alk. paper)
024 $a40016486820
035 $a(OCoLC)ocn277040881
035 $a(OCoLC)277040881
035 $a(NNC)7094607
035 $a7094607
040 $aDLC$cDLC$dYDX$dYDXCP$dOrLoB-B
050 00 $aTK7874.84$b.P35 2009
082 00 $a621.3815/2$222
100 1 $aPaik, Ungyu.$0http://id.loc.gov/authorities/names/n2008080883
245 10 $aNanoparticle engineering for chemical-mechanical planarization :$bfabrication of next-generation nanodevices /$cUngyu Paik, Jea-Gun Park.
260 $aBoca Raton, FL :$bCRC Press/Taylor & Francis Group,$c[2009], ©2009.
300 $axiii, 191 pages, 14 unnumbered pages of plates :$billustrations (some color) ;$c25 cm
336 $atext$btxt$2rdacontent
337 $aunmediated$bn$2rdamedia
504 $aIncludes bibliographical references (p. 171-175) and index.
505 00 $g1.$tOverview of CMP Technology -- $g2.$tInterlayer Dielectric CMP -- $g3.$tShallow Trench Isolation CMP -- $g4.$tCopper CMP -- $g5.$tNanotopography -- $g6.$tNovel CMP for Next-Generation Devices.
520 1 $a"In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology." "Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems."--BOOK JACKET.
650 0 $aChemical mechanical planarization.$0http://id.loc.gov/authorities/subjects/sh2007002521
650 0 $aNanoparticles.$0http://id.loc.gov/authorities/subjects/sh85089689
650 0 $aNanoelectronics.$0http://id.loc.gov/authorities/subjects/sh2006009047
700 1 $aPark, Jea-Gun.$0http://id.loc.gov/authorities/names/n2008080886
852 00 $boff,eng$hTK7874.84$i.P35 2009