It looks like you're offline.
Open Library logo
additional options menu

MARC Record from marc_columbia

Record ID marc_columbia/Columbia-extract-20221130-028.mrc:130504630:3448
Source marc_columbia
Download Link /show-records/marc_columbia/Columbia-extract-20221130-028.mrc:130504630:3448?format=raw

LEADER: 03448cam a2200577 i 4500
001 13725801
005 20220514224416.0
006 m o d
007 cr cnu---unuuu
008 150909s2015 ne a ob 001 0 eng d
035 $a(OCoLC)ocn920564477
035 $a(NNC)13725801
040 $aOPELS$beng$erda$epn$cOPELS$dN$T$dYDXCP$dKNOVL$dCOO$dS4S$dVT2$dREB$dU3W$dD6H$dCEF$dRRP$dS2H$dOCLCO$dOCLCQ$dOCLCO
019 $a1097151807
020 $a9780323312233$q(electronic bk.)
020 $a0323312233$q(electronic bk.)
020 $a0323299652
020 $a9780323299657
020 $z9780323299657
035 $a(OCoLC)920564477$z(OCoLC)1097151807
050 4 $aTK7875
072 7 $aTEC$x009070$2bisacsh
082 04 $a621.3815/2$223
049 $aZCUA
245 00 $aHandbook of silicon based MEMS materials and technologies /$cedited by Markku Tilli [and others].
250 $aSecond edition.
264 1 $aLondon, UK :$bWilliam Andrew is an imprint of Elsevier,$c2015.
300 $a1 online resource :$billustrations
336 $atext$btxt$2rdacontent
337 $acomputer$bc$2rdamedia
338 $aonline resource$bcr$2rdacarrier
490 1 $aMicro & nano technologies
504 $aIncludes bibliographical references and index.
520 $aThe Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.
588 0 $aTitle details screen (ScienceDirect, viewed September 9, 2015).
650 0 $aMicroelectromechanical systems.
650 0 $aMicroelectromechanical systems$xMaterials.
650 0 $aSilicon$xElectric properties.
650 2 $aMicro-Electrical-Mechanical Systems
650 6 $aMicrosystèmes électromécaniques.
650 6 $aMicrosystèmes électromécaniques$xMatériaux.
650 7 $aTECHNOLOGY & ENGINEERING$xMechanical.$2bisacsh
650 7 $aMicroelectromechanical systems.$2fast$0(OCoLC)fst01019745
650 7 $aMicroelectromechanical systems$xMaterials.$2fast$0(OCoLC)fst01019748
650 7 $aSilicon$xElectric properties.$2fast$0(OCoLC)fst01118637
655 4 $aElectronic books.
700 1 $aTilli, Markku,$eeditor.
776 08 $iPrint version:$tHandbook of silicon based MEMS materials and technologies.$bSecond edition.$dAmsterdam, [Netherlands] : William Andrew, ©2015$hxxxvii, 787 pages$kMicro & nano technologies.$z9780323299657
830 0 $aMicro & nano technologies.
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio13725801$zACADEMIC - Mechanics & Mechanical Engineering
852 8 $blweb$hEBOOKS