MARC Record from marc_columbia

Record ID	marc_columbia/Columbia-extract-20221130-030.mrc:156813081:13698
Source	marc_columbia
Download Link	/show-records/marc_columbia/Columbia-extract-20221130-030.mrc:156813081:13698?format=raw

LEADER: 13698cam a2200637Ma 4500
001 14768068
005 20220627131303.0
006 m o d
007 cr cn|||||||||
008 160914s2011 flua ob 001 0 eng d
035 $a(OCoLC)ocn958798998
035 $a(NNC)14768068
040 $aCRCPR$beng$epn$cCRCPR$dOCLCO$dOCLCQ$dN$T$dUKMGB$dUX1$dNLW$dUKAHL$dTYFRS$dOCLCO
066 $c(S
015 $aGBB7B0165$2bnb
016 7 $a018392803$2Uk
020 $a9781439891261$q(electronic bk.)
020 $a1439891265$q(electronic bk.)
020 $a9780429111945$q(electronic bk.)
020 $a0429111940$q(electronic bk.)
035 $a(OCoLC)958798998
037 $aTANDF_250018$bIngram Content Group
037 $a9780429111945$bTaylor & Francis
050 4 $aTK7870.25$b.E43 2011
072 7 $aTEC$x009070$2bisacsh
072 7 $aTEC$x005050$2bisacsh
072 7 $aTEC$x007000$2bisacsh
072 7 $aTEC$x008000$2bisacsh
072 7 $aTJF$2bicssc
082 04 $a621.381044
084 $aTEC005050$aTEC008000$aTEC008070$2bisacsh
049 $aZCUA
100 1 $aEllison, Gordon N.
245 10 $aThermal computations for electronics :$bconductive, radiative, and convective air cooling /$cGordon Ellison.
260 $aBoca Raton, FL :$bCRC Press,$c2011.
300 $a1 online resource (400 pages) :$billustrations
336 $atext$btxt$2rdacontent
337 $acomputer$bc$2rdamedia
338 $aonline resource$bcr$2rdacarrier
504 $aIncludes bibliographical references (pages 387-393) and index.
520 $a"This book covers mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. It provides complete mathematical derivations, supplements formulae with design plots, and offers exercise solutions and lecture aids including PDFs and downloadable Mathcad worksheets. The author covers topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conduction. Offering mathematical descriptions of large thermal network problem formulation, he discusses theory of comprehensive thermal spreading resistance, and includes steady-state and time-dependent problems"--$cProvided by publisher.
520 $a"This book covers mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. It provides complete mathematical derivations, supplements formulae with design plots, and offers exercise solutions and lecture aids. These include landscape-viewable PDF files and downloadable Mathcad worksheet files for text application. The author covers topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conduction. Offering mathematical descriptions of large thermal network problem formulation, he discusses theory of comprehensive thermal spreading resistance (with design curves and applications), and includes steady-state and time-dependent problems"--$cProvided by publisher.
505 0 $aVertical convecting plate Application example: Vertical convecting and radiating plate Vertical parallel plate correlations applicable to circuit board channels Application example: Vertical card assembly Recommended use of vertical channel models in sealed and vented enclosures Conversion of heat transfer coefficients referenced-to-inlet air to referenced-to-local air Application example: Enclosure with circuit boards -- enclosure temperatures only Application example: Enclosure with circuit boards -- circuit board temperatures only Application example: Enclosure with circuit boards, comparison with CFD Application example: Single circuit board enclosure with negligible circuit board radiation Illustrative example: Single circuit board enclosure with radiation exchange between interior enclosure walls and circuit board,
545 0 $aGordon N. Ellison has a BA in Physics from the University of California at Los Angeles (UCLA) and an MA in Physics from the University of Southern California (USC). His career in thermal engineering includes eight years as a Technical Specialist at NCR and 18 years at Tektronix, Inc., retiring from the latter as a Tektronix Fellow. Over the last 15 years Mr. Ellison has been an independent consultant and has also taught the course, Thermal Analysis for Electronics, at Portland State University, Oregon. He has also designed and written several thermal analysis computer codes.
650 0 $aElectronic apparatus and appliances$xThermal properties$xMathematical models.
650 0 $aElectronic apparatus and appliances$xCooling$xMathematics.
650 6 $aAppareils électroniques$xRefroidissement$xMathématiques.
650 7 $aTECHNOLOGY & ENGINEERING / Mechanical$2bisacsh
650 7 $aTECHNOLOGY / Construction / Heating, Ventilation & Air Conditioning$2bisacsh
650 7 $aTECHNOLOGY / Electricity$2bisacsh
650 7 $aTECHNOLOGY / Electronics / General$2bisacsh
655 4 $aElectronic books.
776 08 $iPrint version:$z9781439850176
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio14768068$zTaylor & Francis eBooks
880 0 $6505-00/(S$aIntroductionPrimary mechanisms of heat flowConductionApplication example: Silicon chip resistance calculationConvectionApplication example: Chassis panel cooled by natural convectionRadiationApplication example: Chassis panel cooled only by radiation 7Illustrative example: Simple thermal network model for a heat sinked power transistorIllustrative example: Thermal network circuit for a printed circuit boardCompact component modelsIllustrative example: Pressure and thermal circuits for a forced air cooled enclosureIllustrative example: A single chip package on a printed circuit board-the problemIllustrative example: A single chip package on a printed circuit board-Fourier series solutionIllustrative example: A single chip package on a printed circuit board-thermal network solutionIllustrative example: A single chip package on a printed circuit board-finite element solutionIllustrative example: A single chip package on a printed circuit board-methods comparedThermodynamics of airflowThe first law of thermodynamicsHeat capacity at constant volumeHeat capacity at constant pressure Steady gas flow as an open, steady, single stream Air temperature rise: Temperature dependence Air temperature rise: T identified using differential forms of ΔT,ΔQ Air temperature rise: T identified as average bulk temperatureAirflow I: Forced flow in systemsPreliminaries Bernoulli's equation Bernoulli's equation with losses Fan testing Estimate of fan test error accrued by measurement of downstream static pressure Derivation of the "one velocity" head formula Fan and system matching Adding fans in series and parallel Airflow resistance: Common elements Airflow resistance: True circuit boards Modeled circuit board elements Combining airflow resistances Application example: Forced air cooled enclosure Airflow II: Forced flow in ducts, extrusions, and pin fin arrays The airflow problem for channels with a rectangular cross-section Entrance and exit effects for laminar and turbulent flow Friction coefficient for channel flow Application example: Two-sided extruded heat sink A pin fin correlation Application example: Pin fin problem from Khan, et al. Flow bypass effects according to LeeApplication example: Flow bypass method using Muzychka and Yovanovich correlationApplication example: Flow bypass method using HBT friction factor correlationFlow bypass effects according to Jonsson and MoshfeghApplication example: Pin fin problem using Jonsson and Moshfegh correlationAirflow III: Buoyancy driven draftDerivation of buoyancy driven headMatching buoyancy head to systemApplication example: Buoyancy-draft cooled enclosureSystem models with buoyant airflowForced convective heat transfer I: ComponentsForced convection from a surface The Nusselt and Prandtl numbers The Reynold's number Classical flat plate forced convection correlation: Uniform surface temperature, laminar flowEmpirical correction to classical flat plate forced convectioncorrelation, laminar flowApplication example: Winged aluminum heat sink Classical flat plate forced convection correlation: Uniform heat rate per unit area, laminar flowClassical flat plate (laminar) forced convection correlation extended to small Reynold's numberCircuit boards: Adiabatic heat transfer coefficients and adiabatic temperaturesAdiabatic heat transfer coefficient and temperature according to M. Faghri, et al.Adiabatic heat transfer coefficient and temperature according to R. Wirtz Application example: Circuit board with 1.5 in. / 1.5 in. / 0.6 in. convecting modulesApplication example: Circuit board with 0.82 in./ 0.24 in. /0.123 in. convecting modulesForced convective heat transfer II: Ducts, extrusions, and pin fin arraysBoundary layer considerationsA convection/conduction model for ducts and heat sinksConversion of an isothermal heat transfer coefficient referenced to inlet to referenced to local airNusselt number for fully developed laminar duct flow corrected for entry length effectsA newer Nusselt number for laminar flow in rectangular (cross-section) ductsNusselt number for turbulent duct flowApplication example: Two-sided extruded heat sinkFlow bypass effects according to Jonsson and MoshfeghApplication example: Heat sink in a circuit board channel using the flow bypass method of LeeIn-line and staggered pin fin heat sinksApplication example: Thermal resistance of a pin fin heat sink Natural convection heat transfer I: PlatesNusselt and Grashof numbersClassical flat plate correlationsSmall device flat plate correlationsApplication example: Vertical convecting plateApplication example: Vertical convecting and radiating plateVertical parallel plate correlations applicable to circuit board channelsApplication example: Vertical card assembly Recommended use of vertical channel models in sealed and vented enclosuresConversion of heat transfer coefficients referenced-to-inlet air to referenced-to-local airApplication example: Enclosure with circuit boards - enclosure temperatures onlyApplication example: Enclosure with circuit boards - circuit board temperatures onlyApplication example: Enclosure with circuit boards, comparison with CFDApplication example: Single circuit board enclosure with negligible circuit board radiationIllustrative example: Single circuit board enclosure with radiation exchange between interior enclosure walls and circuit board, results compared with experimentIllustrative example: Metal walled enclosure with ten circuit boardsIllustrative example: Metal walled enclosure with heat dissipation providedNatural convection heat transfer II: Heat sinksHeat sink geometry and some nomenclatureA rectangular U-channel correlation from Van de Pol and TierneyDesign plots representing the Van de Pol & Tierney correlationA few useful formulaeApplication example: Natural convection cooled, vertically oriented heat sinkApplication example: Natural convection cooled, nine fin heat sink compared to test dataThermal radiation heat transferBlackbody radiation Spacial effects and the view factor Application example: View factors for finite parallel plates Non-black surfaces The radiation heat transfer coefficient Application example: Radiation and natural convection cooled enclosure with circuit boardsRadiation for multiple gray-body surfaces Hottel script F (F) method for gray-body radiation exchange Application example: Gray-body circuit boards analyzed as infinite parallel platesApplication example: Gray-body circuit boards analyzed as finite parallel platesThermal radiation networksThermal radiation shielding for rectangular U-channels (fins)Application example: Natural convection and radiation cooled heat sinkApplication example: Nine fin heat sink, compared with test dataApplication example: Natural convection and radiation cooled nine fin heat sinkIllustrative example: Natural convection and radiation cooled heat sinkConduction I: Some basicsFourier's law of heat conductionApplication example: Mica insulator with thermal pasteThermal conduction resistance of some simple structuresThe one-dimensional differential equation for heat conductionApplication example: Aluminum core board with negligible
852 8 $blweb$hEBOOKS