MARC Record from marc_columbia

LEADER: 05142cam a2200685 a 4500
001 15096914
005 20221119231724.0
006 m o d
007 cr unu||||||||
008 140131s2010 fluaf ob 001 0 eng d
035 $a(OCoLC)ocn869567322
035 $a(NNC)15096914
040 $aUMI$beng$epn$cUMI$dDEBBG$dDEBSZ$dIDEBK$dOCLCQ$dYDXCP$dOCLCQ$dCRCPR$dYDX$dN$T$dXPJ$dOCLCQ$dOCLCA$dOCLCF$dCEF$dOCLCQ$dUKMGB$dORZ$dUHL$dK6U$dOCLCO$dOCLCQ$dORMDA
015 $aGBB7B6799$2bnb
016 7 $a018399360$2Uk
019 $a959032144$a1112927257
020 $a1439814678
020 $a9781439814673
020 $a9781439814680
020 $a1439814686
020 $a9781322623443$q(MyiLibrary)
020 $a1322623449
035 $a(OCoLC)869567322$z(OCoLC)959032144$z(OCoLC)1112927257
037 $aCL0500000370$bSafari Books Online
037 $a9781439814680$bO'Reilly Media
050 4 $aTK7870.25$b.S53 2010
072 7 $aTEC$x009070$2bisacsh
082 04 $a621.381$222
084 $aUG 2500$2rvk
049 $aZCUA
100 1 $aShabany, Younes.
245 10 $aHeat transfer :$bthermal management of electronics /$cYounes Shabany.
260 $aBoca Raton, FL :$bCRC Press,$c©2010.
300 $a1 online resource (xv, 491 pages, 16 unnumbered leaves of color plates) :$billustrations
336 $atext$btxt$2rdacontent
337 $acomputer$bc$2rdamedia
338 $aonline resource$bcr$2rdacarrier
588 0 $aOnline resource; title from digital title page (viewed on April 2, 2019).
504 $aIncludes bibliographical references and index.
505 00 $gCh. 1.$tIntroduction --$gCh. 2.$tEnergy, Energy Transfer, and Heat Transfer --$gCh. 3.$tPrinciple of Conservation of Energy --$gCh. 4.$tHeat Transfer Mechanisms --$gCh. 5.$tThermal Resistance Network --$gCh. 6.$tThermal Specification of Microelectric Packages --$gCh. 7.$tFins and Heat Sinks --$gCh. 8.$tHeat Conduction Equation --$gCh. 9.$tFundamentals of Convection Heat Transfer --$gCh. 10.$tForced Convection Heat Transfer: External Flows --$gCh. 11.$tForced Convection Heat Transfer: Internal Flows --$gCh. 12.$tNatural Convection Heat Transfer --$gCh. 13.$tRadiation Heat Transfer --$gCh. 14.$tComputer Simulations and Thermal Design --$gCh. 15.$tExperimental Techniques and Thermal Design --$gCh. 16.$tAdvanced Cooling Technologies --$gAppendix.$tTables of Material Properties.
520 $aThe continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems. Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market. Appropriate thermal management can also create a significant market differentiation, compared to similar systems. Since there are more design flexibilities in the earlier stages of product design, it would be productive to keep the thermal design in mind as early as the concept and feasibility phase. The author first provides the basic knowledge necessary to understand and solve simple electronic cooling problems. He then delves into more detail about heat transfer fundamentals to give the reader a deeper understanding of the physics of heat transfer. Next, he describes experimental and numerical techniques and tools that are used in a typical thermal design process. The book concludes with a chapter on some advanced cooling methods. With its comprehensive coverage of thermal design, this book can help all engineers to develop the necessary expertise in thermal management of electronics and move a step closer to being a multidisciplinary engineer.
650 0 $aElectronic apparatus and appliances$xThermal properties.
650 0 $aElectronic apparatus and appliances$xProtection.
650 0 $aHeat sinks (Electronics)
650 0 $aElectronic packaging.
650 0 $aSystem failures (Engineering)$xPrevention.
650 6 $aAppareils électroniques$xPropriétés thermiques.
650 6 $aAppareils électroniques$xProtection.
650 6 $aDissipateurs thermiques (Électronique)
650 6 $aMise sous boîtier (Électronique)
650 6 $aPannes$xPrévention.
650 7 $aTECHNOLOGY & ENGINEERING$xMechanical.$2bisacsh
650 7 $aElectronic apparatus and appliances$xProtection.$2fast$0(OCoLC)fst00906823
650 7 $aElectronic apparatus and appliances$xThermal properties.$2fast$0(OCoLC)fst00906842
650 7 $aElectronic packaging.$2fast$0(OCoLC)fst00907414
650 7 $aHeat sinks (Electronics)$2fast$0(OCoLC)fst00953979
650 7 $aWärmeübertragung$2gnd
776 08 $iPrint version:$aShabany, Younes.$tHeat transfer.$dBoca Raton : CRC Press, ©2010$z9781439814673$w(DLC) 2009042415$w(OCoLC)461895348
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio15096914$zTaylor & Francis eBooks
852 8 $blweb$hEBOOKS