MARC Record from marc_columbia

LEADER: 06344cam a22009018i 4500
001 15111749
005 20220703233402.0
006 m o d
007 cr |||||||||||
008 160524s2016 onc ob 001 0 eng
010 $a 2016024240
035 $a(OCoLC)ocn950057286
035 $a(NNC)15111749
040 $aDLC$beng$erda$epn$cDLC$dNLC$dOCLCF$dIDEBK$dN$T$dCOO$dEBLCP$dYDX$dDEBSZ$dOCLCQ$dMERUC$dOCLCQ$dU3W$dOCLCQ$dTYFRS$dESU$dUKAHL$dUKMGB$dOCLCQ$dK6U$dOCLCO
015 $aGBB5I6463$2bnb
016 $a(AMICUS)000044528551
016 7 $a017678534$2Uk
019 $a944508087$a958095921$a958392150
020 $a9781771883153$q(electronic bk.)
020 $a1771883154$q(electronic bk.)
020 $a1771883146
020 $a9781771883146
020 $z9781771883146$q(hardcover ;$qalk. paper)
035 $a(OCoLC)950057286$z(OCoLC)944508087$z(OCoLC)958095921$z(OCoLC)958392150
037 $aTANDF_444426$bIngram Content Group
042 $apcc
050 10 $aTP1180.T55
055 0 $aTP1087$bH47 2016
072 7 $aTEC$x009010$2bisacsh
082 00 $a668.4/22$223
084 $acci1icc$2lacc
084 $acoll13$2lacc
049 $aZCUA
100 1 $aHermansen, Ralph D.
245 10 $aPolymeric thermosetting compounds :$binnovative aspects of their formulation technology /$cRalph D. Hermansen.
263 $a1606
264 1 $aToronto :$bApple Academic Press,$c2016.
300 $a1 online resource
336 $atext$btxt$2rdacontent
337 $acomputer$bc$2rdamedia
338 $aonline resource$bcr$2rdacarrier
504 $aIncludes bibliographical references and index.
588 0 $aPrint version record and CIP data provided by publisher; resource not viewed.
520 $a"Engineering design teams sometimes have need of a material that may not exist because the combination of required properties is difficult to achieve. One solution is to develop a new material having the required set of properties needed in the application. During the author's 40-year career he has successfully worked on many such problems. The uniquely useful and valuable book, Polymeric Thermosetting Compounds: Innovative Aspects of Their Formulation Technology, presents twenty of those design problems and the solutions, which resulted in patents and spin-off applications. Author Ralph Hermansen, with years of experience of hands-on experience, is an expert in formulating epoxies, polyurethanes, and other polymers into compounds that have unique properties, and here he shares his knowledge and experience of attaining novel solutions to very challenging problems."--$cProvided by publisher.
505 0 $aFront Cover; Title Page; Copyright Page; About the Author; Contents; List of Abbreviations; Preface; Acknowledgments; Introduction; Part I: Custom Formulating; Chapter 1: Materials and Process Engineering; Chapter 2: The Art and Science of Formulating; Part II: Thermal Transfer Adhesives for Space Electronics; Chapter 3: Thermal Transfer, Filleting Adhesives; Chapter 4: Flexible Epoxy Thermal Transfer Adhesives For Flatpacks; Chapter 5: More About the New Thermal Transfer Adhesives; Chapter 6: Superior Thermal Transfer Adhesive.
505 8 $aPart III: Other Custom-Formulated Compounds for Aerospace Electronics ApplicationsChapter 7: Radiopaque Adhesive/Sealant; Chapter 8: Low Exotherm, Low-Temperature Curing, Epoxy Impregnants; Chapter 9: Platable Adhesives For Cyanate Ester Composites; Chapter 10: Reworkable, Thermally Conductive, Adhesives For Electronic Assemblies; Chapter 11: Room Temperature-Stable, One-Component, Flexible Epoxy Adhesives; Part IV: Custom-Formulated Compounds for Automotive Electronics Applications; Chapter 12: Air Bag Sensor Encapsulation; Chapter 13: Reactive Hot Melt Conformal Coating Materials.
505 8 $aChapter 14: Solder Joint Lead EncapsulationPart V: Custom-Formulated Organic Solder to Eliminate Lead; Chapter 15: Formulation of a Drop-Resistant, Organic Solder; Part VI: Rigid Polyurethanes for Aircraft Transparencies; Chapter 16: Sierraclad"!Bird-Proof Canopies and Windshields; Part VII: Three Niche Technologies; Chapter 17: Flexipoxy Technology; Chapter 18: Hacthane Technology; Chapter 19: Transparent Polyurethane Plastics; Part VIII: Spin-Off Applications; Chapter 20: Spin-Off From Our Thermal Transfer Adhesives Patents.
505 8 $aChapter 21: Spin-Off From Our Electrically Conductive Adhesives PatentsChapter 22: Spin-Off From Our Encapsulants, Potting Compounds, and Impregnants Patents; Chapter 23: Spin-Off From Our High-Volume Electronic Assembly Materials Patents; Chapter 24: Spin-Off From Our Specialty Adhesives Patents; Chapter 25: Spin-Off From Our Specialty Rigid Thermosets Patents; Appendix I: The Science of Rubbery Materials; Back Cover.
650 0 $aThermosetting plastics.
650 0 $aThermosetting composites.
650 0 $aHeat resistant plastics.
650 0 $aMaterials at high temperatures.
650 0 $aMaterials at low temperatures.
650 0 $aPolymers.
650 0 $aElastomers.
650 6 $aThermodurcissables.
650 6 $aComposites thermodurcissables.
650 6 $aMatières plastiques réfractaires.
650 6 $aMatériaux à hautes températures.
650 6 $aMatériaux à basses températures.
650 6 $aPolymères.
650 6 $aÉlastomères.
650 7 $athermoset.$2aat
650 7 $apolymers.$2aat
650 7 $aelastomer.$2aat
650 7 $aTECHNOLOGY & ENGINEERING$xChemical & Biochemical.$2bisacsh
650 7 $aElastomers.$2fast$0(OCoLC)fst00904231
650 7 $aHeat resistant plastics.$2fast$0(OCoLC)fst00953976
650 7 $aMaterials at high temperatures.$2fast$0(OCoLC)fst01011904
650 7 $aMaterials at low temperatures.$2fast$0(OCoLC)fst01011911
650 7 $aPolymers.$2fast$0(OCoLC)fst01070588
650 7 $aThermosetting composites.$2fast$0(OCoLC)fst01149921
650 7 $aThermosetting plastics.$2fast$0(OCoLC)fst01149924
655 0 $aElectronic books.
655 4 $aElectronic books.
776 08 $iPrint version:$aHermansen, Ralph D.$tPolymeric thermosetting compounds.$dToronto : Apple Academic Press, 2016$z9781771883146$w(DLC) 2016021765
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio15111749$zTaylor & Francis eBooks
852 8 $blweb$hEBOOKS