MARC Record from marc_columbia

LEADER: 05492cam a2201081Mi 4500
001 15236430
005 20220611224348.0
006 m o d
007 cr |n|||||||||
008 190724t20192019enk fo 000 0 eng d
035 $a(OCoLC)on1112093460
035 $a(NNC)15236430
040 $aSTF$beng$epn$cSTF$dOCLCO$dUIU$dOCLCF$dCUS$dEBLCP$dOCLCQ$dUX1$dUKAHL$dYDX$dSFB$dN$T$dK6U$dOCLCO
019 $a1135941621
020 $a178561360X
020 $a9781785613609$q(electronic bk.)
020 $z1785613596
020 $z9781785613593
035 $a(OCoLC)1112093460$z(OCoLC)1135941621
050 4 $aTK6561
072 7 $aB0120$2inspec
072 7 $aB0170J$2inspec
072 7 $aB1350$2inspec
082 04 $a621.38411
049 $aZCUA
100 1 $aAlmalkawi, Mohammad,$eauthor.
245 10 $aRF and Microwave Module Level Design and Integration /$cMohammad Almalkawi.
264 1 $aLondon :$bThe Institution of Engineering and Technology,$c2019.
264 4 $c©2019
300 $a1 online resource (337 pages)
336 $atext$btxt$2rdacontent
337 $acomputer$bc$2rdamedia
338 $aonline resource$bcr$2rdacarrier
490 1 $aIET Materials, Circuits and Devices series ;$v34
520 $aThis book is intended to bring together fundamental concepts and elements needed in the design, integration, and characterization phases of modern radio frequency (RF) and microwave modules and to familiarize the interested reader with the common challenges in this rapidly changing field. While design for manufacturability (DFM) and design for testability (DFT) are two important practices that stress the need for careful attention at the early design stages of a product, module integration to achieve optimal RF performance is an art form that takes years to master. In this context, the objective of this book is to provide the necessary practical and theoretical background needed to tackle a multitude of issues accompanied by the design of contemporary RF modules. The topics covered can serve a broad range of individuals: those just entering the field, graduate-level students, and researchers, as well as practicing engineers seeking new domains to expand their knowledge, understand design tradeoffs, and looking for a quick guide in digesting the several aspects of the RF module design processes and their common challenges. The book comprises eight chapters which discuss: packaging, lumped and distributed passive elements, microwave network analysis, impedance matching networks, electromagnetic field couplings, CAD, components of RF front-end modules, component- and module-level measurements.
588 0 $aOnline resource; title from PDF title page (IET, viewed September 23, 2019).
650 0 $aComputer-aided design.
650 0 $aElectric circuits.
650 0 $aElectric networks, Passive.
650 0 $aElectronic circuit design.
650 0 $aElectronic packaging.
650 0 $aImpedance matching.
650 0 $aLumped elements (Electronics)
650 0 $aMicrowave circuits.
650 6 $aConception assistée par ordinateur.
650 6 $aCircuits électriques.
650 6 $aRéseaux passifs (Télécommunications)
650 6 $aCircuits électroniques$xCalcul.
650 6 $aMise sous boîtier (Électronique)
650 6 $aAdaptation d'impédance.
650 6 $aConstantes localisées (Électronique)
650 6 $aCircuits pour micro-ondes.
650 7 $acomputer-aided designs (visual works)$2aat
650 7 $acircuits.$2aat
650 7 $aComputer-aided design.$2fast$0(OCoLC)fst00872701
650 7 $aElectric circuits.$2fast$0(OCoLC)fst00904545
650 7 $aElectric networks, Passive.$2fast$0(OCoLC)fst00905350
650 7 $aElectronic circuit design.$2fast$0(OCoLC)fst00906862
650 7 $aElectronic packaging.$2fast$0(OCoLC)fst00907414
650 7 $aImpedance matching.$2fast$0(OCoLC)fst00968089
650 7 $aLumped elements (Electronics)$2fast$0(OCoLC)fst01003679
650 7 $aMicrowave circuits.$2fast$0(OCoLC)fst01020171
650 7 $acircuit CAD.$2inspect
650 7 $aelectromagnetic coupling.$2inspect
650 7 $aelectronics packaging.$2inspect
650 7 $aimpedance matching.$2inspect
650 7 $alumped parameter networks.$2inspect
650 7 $amicrowave circuits.$2inspect
650 7 $amodules.$2inspect
650 7 $apassive networks.$2inspect
653 $aRF front-end modules
653 $amodule-level measurements
653 $acomponent-level measurements
653 $aRF circuits
653 $aCAD
653 $amicrowave circuits
653 $aelectromagnetic field couplings
653 $aimpedance matching networks
653 $amicrowave network analysis
653 $adistributed passive elements
653 $alumped passive elements
653 $amicrowave device
653 $aRF device
653 $adevice packaging
653 $amodule packaging
655 0 $aElectronic books.
655 4 $aElectronic books.
776 08 $iPrint version:$z9781785613609
776 08 $iPrint version:$z1785613596$z9781785613593$w(OCoLC)1089417906
830 0 $aMaterials, circuits and devices series ;$v34.
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio15236430.001$zACADEMIC - Electronics & Semiconductors
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio15236430.002$zACADEMIC - Aerospace & Radar Technology
852 8 $blweb$hEBOOKS