| Record ID | marc_columbia/Columbia-extract-20221130-031.mrc:36881293:3864 |
| Source | marc_columbia |
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LEADER: 03864cam a22006614a 4500
001 15069186
005 20210607124633.0
006 m o d
007 cr |n|||||||||
008 060524s2007 flua obf 001 0 eng c
035 $a(OCoLC)ocm82929208
035 $a(NNC)15069186
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015 $aGBA665175$2bnb
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019 $a326982408$a779923434$a814473479$a992017951$a995044968$a1006803012$a1031050282$a1066015183$a1086946393
020 $a9781420017632$q(electronic bk.)
020 $a1420017632$q(electronic bk.)
020 $a1280730226
020 $a9781280730221
020 $z1574446703$q(alk. paper)
020 $z9781574446708$q(alk. paper)
024 7 $a10.1201/9781420017632$2doi
035 $a(OCoLC)82929208$z(OCoLC)326982408$z(OCoLC)779923434$z(OCoLC)814473479$z(OCoLC)992017951$z(OCoLC)995044968$z(OCoLC)1006803012$z(OCoLC)1031050282$z(OCoLC)1066015183$z(OCoLC)1086946393
037 $aTANDF_186472$bIngram Content Group
042 $apcc
050 4 $aTJ1280$b.H424 2007
072 7 $aTEC$x040000$2bisacsh
072 7 $aTDM$2bicssc
082 04 $a671.3/5$222
049 $aZCUA
245 00 $aHandbook of lapping and polishing /$cedited by Ioan D. Marinescu, Eckart Uhlmann, Toshiro K. Doi.
260 $aBoca Raton, FL :$bCRC Press,$c©2007.
300 $a1 online resource (491 pages) :$billustrations
336 $atext$btxt$2rdacontent
337 $acomputer$bc$2rdamedia
338 $aonline resource$bcr$2rdacarrier
347 $adata file$2rda
490 1 $aManufacturing engineering and materials processing ;$v73
504 $aIncludes bibliographical references and index.
588 0 $aPrint version record.
505 0 $aFront cover; Preface; Editors; Contributors; Table of Contents; Chapter 1. Introduction; Chapter 2. Fundamentals of Lapping; Chapter 3. Lapping of Ductile Materials; Chapter 4. Lapping of Brittle Materials; Chapter 5. Lapping and Lapping Machines; Chapter 6. Polishing Technology; Chapter 7. Chemical Mechanical Polishing and Its Applications in ULSI Process; Index; Back cover.
520 $aThis is the first English language book to describe the most precise processes available for finishing the surfaces of mechanical as well as electronics and semiconductor components. The Handbook of Lapping and Polishing begins with an introduction focused on the fundamental concepts and the basics of lapping and polishing processes. The book builds on this foundation to discuss lapping of ductile and brittle materials, with a special chapter devoted to lapping equipment. Sections on polishing and chemical-mechanical polishing (CMP) round out the discussion. Experts from the US, Germany, and J.
650 0 $aGrinding and polishing$vHandbooks, manuals, etc.
650 7 $aTECHNOLOGY & ENGINEERING$xTechnical & Manufacturing Industries & Trades.$2bisacsh
650 7 $aGrinding and polishing.$2fast$0(OCoLC)fst00947952
655 0 $aElectronic books.
655 4 $aElectronic books.
655 7 $aHandbooks and manuals.$2fast$0(OCoLC)fst01423877
700 1 $aMarinescu, Ioan D.
700 1 $aUhlmann, Eckart.
700 1 $aDoi, Toshiro K.,$d1947-
776 08 $iPrint version:$tHandbook of lapping and polishing.$dBoca Raton, FL : CRC Press, ©2007$z1574446703$z9781574446708$w(DLC) 2006017436$w(OCoLC)69734472
830 0 $aManufacturing engineering and materials processing ;$v73.
856 40 $uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio15069186$zTaylor & Francis eBooks
852 8 $blweb$hEBOOKS