| Record ID | marc_loc_2016/BooksAll.2016.part20.utf8:40842827:660 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part20.utf8:40842827:660?format=raw |
LEADER: 00660pam a2200217 a 4500
001 90012968
003 DLC
005 19910913094945.8
008 900814s1991 nyua b 00100 eng
010 $a 90012968
020 $a0442002602
040 $aDLC$cDLC$dDLC
050 00 $aTA492.W4$bS63 1991
082 00 $a671.5/2042$220
245 00 $aSolder joint reliability :$btheory and applications /$cedited by John H. Lau.
260 0 $aNew York :$bVan Nostrand Reinhold,$cc1991.
300 $axx, 631 p. :$bill. ;$c24 cm.
504 $aIncludes bibliographical references and index.
650 0 $aWelded joints.
650 0 $aSolder and soldering.
700 10 $aLau, John H.