| Record ID | marc_loc_2016/BooksAll.2016.part20.utf8:48534616:1112 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part20.utf8:48534616:1112?format=raw |
LEADER: 01112pam a2200253 a 4500
001 90026534
003 DLC
005 19990716000000.0
008 901130s1991 enka b 100 0 eng
010 $a 90026534
020 $a1851665919
040 $aDLC$cDLC$dDLC
050 00 $aTS718$b.I568 1990
082 00 $a671.5/8$220
111 2 $aInternational Conference on Diffusion Bonding$n(2nd :$d1990 :$cCranfield Institute of Technology)
245 10 $aDiffusion bonding 2 /$cedited by D.J. Stephenson.
260 $aLondon ;$aNew York :$bElsevier Applied Science ;$aNew York, NY, USA :$bSole distributor in the USA and Canada, Elsevier Science Pub. Co.,$c1991.
300 $ax, 316 p. :$bill. ;$c25 cm.
500 $a"Proceedings of the Second International Conference on Diffusion Bonding, held at Cranfield Institute of Technology, U.K., from 28 to 29 March, 1990."
504 $aIncludes bibliographical references.
650 0 $aDiffusion bonding (Metals)$xCongresses.
650 0 $aAluminum alloys$xBonding$xCongresses.
650 0 $aHeat resistant materials$xCongresses.
700 1 $aStephenson, D. J.$q(David J.)