| Record ID | marc_loc_2016/BooksAll.2016.part21.utf8:222029656:1861 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part21.utf8:222029656:1861?format=raw |
LEADER: 01861nam a2200373 a 4500
001 92054493
003 DLC
005 19951128121800.0
008 931021s1993 nyua b 101 0 eng d
010 $a 92054493
020 $a0780307550 (softbound)
020 $a0780307569 (casebound)
020 $a0780307577 (microfiche)
035 $a(OCoLC)27046535
040 $aMiHM$cMiHM$dIU$dDLC
042 $alccopycat
050 00 $aTK7836$b.I4 1992
082 00 $a621.381$220
111 2 $aIEEE/CHMT International Electronics Manufacturing Technology Symposium$n(13th :$d1992 :$cBaltimore, Md.)
245 10 $aThirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium :$bintegrated manufacturing, the future is now : September 28-30, 1992, Baltimore, MD, USA /$cgeneral chair, John Lau ... [et al.].
246 3 $aIntegrated manufacturing, the future is now
246 18 $aThirteenth IEEE International Electronics Manufacturing Technology (IEMT) Symposium
260 $aNew York :$bInstitute of Electrical and Electronics Engineers ;$aPiscataway, NJ :$bIEEE Service Center [distributor],$cc1992.
300 $axvii, 381 p. :$bill. ;$c28 cm.
500 $a"Sponsored by the Electronics Industries Association, IEEE Components Hybrids, and Manufacturing Technology Society"--Cover.
500 $a"IEEE catalog number 92CH3190-6"--T.p. verso.
504 $aIncludes bibliographical references and index.
650 0 $aElectronic industries$xCongresses.
650 0 $aElectronic apparatus and appliances$xDesign and construction$xCongresses.
650 0 $aProduction engineering$xCongresses.
650 0 $aMultichip modules (Microelectronics)$xDesign and construction$xCongresses.
700 1 $aLau, John H.
710 2 $aElectronic Industries Association.
710 2 $aIEEE Components, Hybrids, and Manufacturing Technology Society.