| Record ID | marc_loc_2016/BooksAll.2016.part22.utf8:185867026:1001 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part22.utf8:185867026:1001?format=raw |
LEADER: 01001cam a2200265 a 4500
001 93046641
003 DLC
005 19940404130532.2
008 931126s1994 nyua b 001 0 eng
010 $a 93046641
020 $a007023552X (acid-free paper) :$c$45.00
040 $aDLC$cDLC$dDLC
050 00 $aTK7870.15$b.G563 1994
082 00 $a621.381/046$220
100 1 $aGinsberg, Gerald L.
245 10 $aMultichip modules and related technologies :$bMCM, TAB, and COB design /$cGerald L. Ginsberg, Donald P. Schnorr.
260 $aNew York :$bMcGraw-Hill,$cc1994.
300 $axiv, 290 p. :$bill. ;$c24 cm.
440 0 $aElectronic packaging and interconnection series
500 $aCover title: Multichip modules & related technologies.
504 $aIncludes bibliographical references and index.
650 0 $aElectronic packaging.
650 0 $aMultichip modules (Microelectronics)$xDesign and construction.
700 10 $aSchnorr, Donald P.
740 01 $aMultichip modules & related technologies.