| Record ID | marc_loc_2016/BooksAll.2016.part24.utf8:123889617:917 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part24.utf8:123889617:917?format=raw |
LEADER: 00917cam a2200253 a 4500
001 95044649
003 DLC
005 20030428101043.0
008 950929s1996 maua b 001 0 eng
010 $a 95044649
020 $a0070366098
040 $aDLC$cDLC$dDLC
050 00 $aTK7874$b.F5897 1996
082 00 $a621.381/046$220
245 00 $aFlip chip technologies /$cJohn H. Lau, editor.
260 $aBoston, Mass. :$bMcGraw-Hill,$cc1996.
300 $axxiv, 565 p. :$bill. ;$c24 cm.
440 0 $aElectronic packaging and interconnection series
504 $aIncludes bibliographical references and index.
650 0 $aIntegrated circuits$xVery large scale integration$xDesign and construction.
650 0 $aFlip chip technology.
650 0 $aMultichip modules (Microelectronics)$xDesign and construction.
700 1 $aLau, John H.
856 41 $3Table of contents$uhttp://www.loc.gov/catdir/toc/mh022/95044649.html