| Record ID | marc_loc_2016/BooksAll.2016.part24.utf8:123905720:1644 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part24.utf8:123905720:1644?format=raw |
LEADER: 01644cam a2200301 a 4500
001 95044669
003 DLC
005 20060719194517.0
008 951002s1995 dcua b 101 0 eng
010 $a 95044669
020 $a0841233322 (acid-free paper)
040 $aDLC$cDLC$dDLC
050 00 $aTK7874$b.M475 1995
082 00 $a621.381/046$220
245 00 $aMicroelectronics technology :$bpolymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995 /$cElsa Reichmanis ... [et al., editors].
260 $aWashington, DC :$bAmerican Chemical Society,$c1995.
300 $axii, 563 p. :$bill. ;$c24 cm.
440 0 $aACS symposium series ;$v614
504 $aIncludes bibliographical references and indexes.
650 0 $aMicroelectronic packaging$xMaterials$xCongresses.
650 0 $aPolymers$xCongresses.
650 0 $aPhotoresists$xCongresses.
700 1 $aReichmanis, Elsa,$d1953-
710 2 $aAmerican Chemical Society.$bDivision of Polymeric Materials: Science and Engineering.
710 2 $aKōbunshi Gakkai (Japan).$bPolymers for Microelectronics Division.
710 2 $aAmerican Chemical Society.$bMeeting$n(209th :$d1995 :$cAnaheim, Calif.)
856 42 $3Publisher description$uhttp://www.loc.gov/catdir/enhancements/fy0605/95044669-d.html
856 41 $3Table of contents only$uhttp://www.loc.gov/catdir/enhancements/fy0605/95044669-t.html