Record ID | marc_loc_2016/BooksAll.2016.part24.utf8:46872530:1097 |
Source | Library of Congress |
Download Link | /show-records/marc_loc_2016/BooksAll.2016.part24.utf8:46872530:1097?format=raw |
LEADER: 01097cam a2200301 a 4500
001 94465176
003 DLC
005 20070829152721.0
008 940707s1993 ja a b 000 0 jpn
010 $a 94465176
035 $a(CStRLIN)DCLP94-B12951
040 $aDLC-R$cDLC-R$dDLC
043 $aa-ja---
050 00 $aHD9696.S43$bJ383 1993
066 $c$1
245 00 $6880-01$aShutsugan keitōzu :$binʼyō bunken kara mita handōtai gijutsu no tokushoku /$cTokkyochō hen.
250 $6880-02$aShohan.
260 $6880-03$aTōkyō :$bHatsumei Kyōkai,$cHeisei 5 [1993]
300 $a383 p. :$bill. ;$c30 cm.
500 $aCover title.
504 $aIncludes bibliographical references.
650 0 $aSemiconductor industry$zJapan$xTechnological innovations.
650 0 $aPatents$zJapan.
710 1 $6880-04$aJapan.$bTokkyochō.
880 00 $6245-01/$1$a出願系統図 :$b引用文献からみた半導体技術の特色 /$c特許庁編.
880 $6250-02/$1$a初版.
880 $6260-03/$1$a東京 :$b発明協会,$c平成 5 [1993]
880 1 $6710-04/$1$aJapan.$b特許庁.