| Record ID | marc_loc_2016/BooksAll.2016.part25.utf8:102964563:938 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part25.utf8:102964563:938?format=raw |
LEADER: 00938cam a2200265 a 4500
001 96037907
003 DLC
005 19971006142549.4
008 961125s1997 nyua bf 001 0 eng
010 $a 96037907
020 $a0412084317 (pt. 1)
020 $a0412084414 (pt. 2)
020 $a0412084511 (pt. 3)
040 $aDLC$cDLC$dDLC
050 00 $aTK7874$b.M485 1997
082 00 $a621.381/046$221
245 00 $aMicroelectronics packaging handbook /$cedited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein.
250 $a2nd ed.
260 $aNew York :$bChapman & Hall,$cc1997.
300 $a3 v. :$bill. ;$c24 cm.
504 $aIncludes bibliographical references and index.
505 0 $apt. 1. Technology drivers -- pt. 2. Semiconductor packaging -- pt. 3. Subsystem packaging.
650 0 $aMicroelectronic packaging$xHandbooks, manuals, etc.
700 1 $aTummala, Rao R.,$d1942-
700 1 $aRymaszewski, Eugene J.