| Record ID | marc_loc_2016/BooksAll.2016.part26.utf8:122245739:838 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part26.utf8:122245739:838?format=raw |
LEADER: 00838nam a2200253 a 4500
001 97144999
003 DLC
005 19970516101114.9
008 970429s1994 ctua b 000 0 eng
010 $a 97144999
020 $a156965204X
040 $aDLC$cDLC
050 00 $aHD9696.I582$bK58 1994
100 1 $aKnipfer, Brent J.
245 10 $aMultichip packaging and bare chip systems /$cBrent J. Knipfer, project analyst.
260 $aNorwalk, CT :$bBusiness Communications Co.,$c1994.
300 $axxxi, 257 p. :$bill. ;$c28 cm.
440 0 $aBusiness opportunity report ;$vGB-138R
504 $aIncludes bibliographical references.
650 0 $aIntegrated circuits industry.
650 0 $aMultichip modules (Microelectronics)
650 0 $aMicroelectronic packaging.
650 0 $aMarket surveys.
710 20 $aBusiness Communications Co.