| Record ID | marc_loc_2016/BooksAll.2016.part27.utf8:85927341:709 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part27.utf8:85927341:709?format=raw |
LEADER: 00709nam a2200229 a 4500
001 98139407
003 DLC
005 19980512153110.8
008 980415s1997 txua b 000 0 eng
010 $a 98139407
040 $aDLC$cDLC
050 00 $aTK7874$b.I93 1997
082 00 $a621.3815$221
245 00 $aIVF CSP project prestudy state of the industry assessment.
260 $aAustin, Tex. :$bTechSearch International,$c1997.
300 $avi, 89 p. :$bill. ;$c28 cm.
500 $aCover title.
500 $a"March 1997."
504 $aIncludes bibliographical references.
650 0 $aIntegrated circuits$xDesign and construction.
650 0 $aMicroelectronic packaging.
710 2 $aTechSearch International.