| Record ID | marc_loc_2016/BooksAll.2016.part29.utf8:9405410:433 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part29.utf8:9405410:433?format=raw |
LEADER: 00433cam a22001457a 4500
001 2001272492
003 DLC
005 20060621094645.0
008 010814s1999 azu 000 0 eng
010 $a 2001272492
040 $aDLC$cDLC
050 00 $aMLCM 2006/04844 (T)
245 00 $aComparative Analysis of new designs for wirebond pads.
260 $aScottsdale, AZ :$bIntegrated Circuit Engineering,$cc1999.
300 $a1 v. (various pagings) ;$c28 cm.