Record ID | marc_loc_2016/BooksAll.2016.part30.utf8:217681774:1613 |
Source | Library of Congress |
Download Link | /show-records/marc_loc_2016/BooksAll.2016.part30.utf8:217681774:1613?format=raw |
LEADER: 01613cam a22003497a 4500
001 2003116315
003 DLC
005 20061222121825.0
008 031208s2004 njua b 101 0 eng d
010 $a 2003116315
020 $a0780383087
035 $a(OCoLC)ocm56388065
040 $aLHL$cLHL$dOCLCQ$dE9X$dOCLCQ$dDLC
042 $alccopycat
050 00 $aTK7871.85$b.I5795 2004
082 00 $a621.3815/2$222
111 2 $aInternational Interconnect Technology Conference$d(2004 :$cBurlingame, Calif.)
245 10 $aProceedings of the IEEE 2004 International Interconnect Technology Conference :$bHyatt Regency Hotel, Burlingame, CA, June 7-9, 2004 /$cthe IITC is sponsored by the IEEE Electron Devices Society.
246 30 $aInternational Interconnect Technology Conference
246 30 $aInterconnect technology
246 14 $aIITC
260 $aPiscataway, N.J. :$bIEEE,$cc2004.
300 $a253 p. :$bill. ;$c28 cm.
504 $aIncludes bibliographical references and author index.
500 $a"IEEE Catalog Number: 04TH8729"--T.p. verso.
530 $aAlso issued online with additional title: Interconnect Technology Conference, 2004, Proceedings of the IEEE 2004 International.
650 0 $aSemiconductors$xJunctions$vCongresses.
650 0 $aSemiconductors$xDesign and construction$vCongresses.
650 0 $aElectric contacts$vCongresses.
710 2 $aIEEE Electron Devices Society.
740 0 $aInterconnect Technology Conference, 2004, Proceedings of the IEEE 2004 International.
856 41 $uhttp://ieeexplore.ieee.org/servlet/opac?punumber=9318$zRestricted to IEEE Xplore subscribers