MARC Record from Library of Congress

LEADER: 01490cam a22003257a 4500
001 2003271418
003 DLC
005 20031002081639.0
008 030619s2002 nyua b 101 0 eng d
010 $a 2003271418
020 $a0791836487
035 $a(OCoLC)ocm51624795
040 $aGAT$cGAT$dDLC
042 $alccopycat
050 00 $aTK7870.15$b.E39 2002
245 00 $aElectronic and photonic packaging, electrical systems and photonic design, and nanotechnology :$bpresented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana /$csponsored by the Electronic and Photonic Packaging Division, ASME.
260 $aNew York :$bAmerican Society of Mechanical Engineers,$cc2002.
300 $axiii, 572 p. :$bill. ;$c28 cm.
490 1 $aEPP ;$vvol. 2
504 $aIncludes bibliographical references and index.
650 0 $aElectronic packaging$vCongresses.
650 0 $aPhotonics$vCongresses.
650 0 $aNanotechnology$vCongresses.
650 0 $aMicroelectronic packaging$vCongresses.
650 0 $aSurface mount technology$vCongresses.
650 0 $aMicroelectromechanical systems$vCongresses.
650 0 $aIntegrated circuits$xWafer-scale integration$vCongresses.
710 2 $aAmerican Society of Mechanical Engineers.$bElectronic and Photonic Packaging Division.
711 2 $aInternational Mechanical Engineering Congress and Exposition$d(2002 :$cNew Orleans, La.)
830 0 $aEPP (Series) ;$vv. 2.