| Record ID | marc_loc_2016/BooksAll.2016.part32.utf8:173937099:989 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part32.utf8:173937099:989?format=raw |
LEADER: 00989cam a22002774a 4500
001 2005051088
003 DLC
005 20060724201525.0
008 050628s2006 nyua b 001 0 eng
010 $a 2005051088
020 $a0071455442 (acid-free paper)
040 $aDLC$cDLC$dDLC
042 $apcc
050 00 $aTP1180.E6$bP48 2006
082 00 $a668/.374$222
100 1 $aPetrie, Edward M.
245 10 $aEpoxy adhesive formulations /$cEdward M. Petrie.
260 $aNew York :$bMcGraw-Hill,$cc2006.
300 $axv, 535 p. :$bill. ;$c24 cm.
504 $aIncludes bibliographical references and index.
650 0 $aEpoxy resins$xFormability.
650 0 $aEpoxy compounds$xFormability.
650 0 $aEpoxy coatings$xFormability.
650 0 $aAdhesives$xFormability.
856 42 $3Contributor biographical information$uhttp://www.loc.gov/catdir/enhancements/fy0625/2005051088-b.html
856 42 $3Publisher description$uhttp://www.loc.gov/catdir/enhancements/fy0625/2005051088-d.html