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MARC Record from Library of Congress

Record ID marc_loc_updates/v36.i05.records.utf8:30962664:1553
Source Library of Congress
Download Link /show-records/marc_loc_updates/v36.i05.records.utf8:30962664:1553?format=raw

LEADER: 01553cam a2200277 a 4500
001 94076982
003 DLC
005 20080201181601.0
008 940519s1994 paua b 101 0 eng
010 $a 94076982
020 $a087339206X
040 $aDLC$cDLC$dDLC
050 00 $aTA483$b.M55 1992
082 00 $a620.1/61$220
110 2 $aMinerals, Metals and Materials Society.$bMeeting$d(1992 :$cChicago, Ill.)
245 10 $aLow thermal expansion alloys and composites :$bproceedings of a symposium co-sponsored by the Refractory Metals Committee of the Structural Materials Division (SMD) and the Electronic Packaging and Interconnection Materials Committee of the Electronic, Magnetic, and Photonics Materials Division (EMPMD), held at the Fall Meeting of the Minerals, Metals and Materials Society in Chicago, Illinois, November 2-5, 1992 /$cedited by John J. Stephens and Darrel R. Frear.
260 $aWarrendale, Pa. :$bMinerals, Metals & Materials Society,$cc1994.
300 $aviii, 225 p. :$bill. ;$c24 cm.
504 $aIncludes bibliographical references and indexes.
650 0 $aAlloys$xExpansion and contraction$vCongresses.
650 0 $aIron-nickel-cobalt alloys$xExpansion and contraction$vCongresses.
650 0 $aComposite materials$xExpansion and contraction$vCongresses.
700 1 $aStephens, John J.
700 1 $aFrear, D. R.
710 2 $aMinerals, Metals and Materials Society.$bRefractory Metals Committee.
710 2 $aMinerals, Metals and Materials Society.$bElectronic Packaging and Interconnection Materials Committee.