Record ID | marc_loc_updates/v36.i10.records.utf8:26234284:1340 |
Source | Library of Congress |
Download Link | /show-records/marc_loc_updates/v36.i10.records.utf8:26234284:1340?format=raw |
LEADER: 01340cam a22003374a 4500
001 2006922729
003 DLC
005 20080310103622.0
008 060222s2007 nyua b 001 0 eng c
010 $a 2006922729
015 $aGBA669022$2bnb
016 7 $a013527927$2Uk
020 $a0387279741 (hbk.)
020 $a9780387279749 (hbk.)
035 $a(OCoLC)ocm70882598
040 $aUKM$cUKM$dBAKER$dNDD$dYDXCP$dDLC
042 $apcc
050 00 $aTK7874$b.M43864 2007
082 00 $a621.381$222
245 00 $aMicro- and opto-electronic materials and structures :$bphysics, mechanics, design, reliability, packaging /$cedited by E. Suhir, Y.C. Lee, C.P. Wong.
260 $aNew York :$bSpringer,$cc2007.
300 $a2 v. :$bill. (some col.) ;$c26 cm.
505 0 $av.1. Materials physics/Materials mechanics -- v.2. Physical design/Reliability and packaging.
650 0 $aMicroelectronics.
650 0 $aOptoelectronics.
700 1 $aSuhir, Ephraim.
700 1 $aLee, Y. C.
700 1 $aWong, C. P.,$d1947-
856 42 $3Contributor biographical information$uhttp://www.loc.gov/catdir/enhancements/fy0819/2006922729-b.html
856 42 $3Publisher description$uhttp://www.loc.gov/catdir/enhancements/fy0819/2006922729-d.html
856 41 $3Table of contents only$uhttp://www.loc.gov/catdir/enhancements/fy0819/2006922729-t.html